XC7K325T-L2FFG676E

The XC7K325T-L2FFG676E is a Kintex®-7 Field Programmable Gate Array (FPGA) IC offering a large logic fabric and on-chip memory in a compact FCBGA package. It provides 326,080 logic elements and approximately 16.4 Mbits of embedded memory, making it suitable for designs that require substantial programmable logic capacity and embedded storage within a surface-mount form factor.

Key device characteristics include a 400-pin I/O count, a supply voltage range of 870 mV to 930 mV, an extended temperature grade (0°C to 100°C), and RoHS compliance.

Key Features

• Logic Capacity 326,080 logic elements provide a large programmable fabric for complex combinational and sequential logic implementations.
• Embedded Memory Approximately 16.4 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage for custom logic blocks.
• I/O Density 400 user I/O pins suitable for multi-channel interfaces and parallel connectivity in space-constrained designs.
• Power Supply Operates from a supply voltage range of 870 mV to 930 mV, enabling integration with low-voltage system rails.
• Package and Mounting 676-FCBGA (27×27) ball-grid array, surface-mount package for compact board-level integration.
• Temperature and Grade Extended grade operation from 0°C to 100°C for applications requiring commercial extended-range thermal performance.
• Compliance RoHS compliant, supporting environmentally conscious assembly and manufacturing processes.

Typical Applications

• High-density programmable logic — Implement large-scale custom logic functions and parallel processing pipelines using the device's extensive logic element count.
• Memory‑centric designs — Use the on-chip ~16.4 Mbits of RAM for buffering, packet processing, and temporary data storage within custom accelerators.
• I/O-rich systems — Leverage 400 I/O pins for multi-lane interfaces, sensor arrays, or mixed-signal front-end connectivity.

Unique Advantages

• High logic capacity: 326,080 logic elements provide headroom for complex logic integration without immediate partitioning across devices.
• Substantial embedded memory: Approximately 16.4 Mbits of on-chip RAM reduces reliance on external memory for many buffering and local storage needs.
• Compact FCBGA package: 676-FCBGA (27×27) allows high integration density on modern PCBs while maintaining a surface-mount assembly flow.
• Wide I/O count: 400 user I/Os enable flexible system interfacing across multiple channels and protocols.
• Extended temperature grade: Rated 0°C to 100°C to support designs with extended commercial temperature requirements.
• RoHS compliant: Meets common environmental compliance expectations for modern electronic products.

Why Choose XC7K325T-L2FFG676E?

The XC7K325T-L2FFG676E balances a large logic resource pool and meaningful on-chip memory with a compact 676-FCBGA surface-mount package and 400 I/O pins. Its voltage operating window of 870 mV to 930 mV and extended temperature grade make it suitable for systems that require significant programmable logic capacity within controlled thermal and power envelopes.

This device is well suited for designers and engineers building resource-intensive FPGA-based solutions that demand high logic density, ample embedded RAM, and flexible I/O in a RoHS-compliant, surface-mount form factor.

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