XC7K325T-L2FFG900I

The XC7K325T-L2FFG900I is a Kintex®-7 Field Programmable Gate Array (FPGA) offered in a 900‑ball FCBGA package. It delivers a substantial programmable fabric with 326,080 logic elements, on‑chip embedded memory, and a high count of user I/O for complex logic and interface implementations.

Designed for industrial applications, this device provides a combination of large logic capacity, approximately 16.4 Mbits of embedded memory, and up to 500 user I/O in a compact 31×31 900‑FCBGA footprint, with an operating range and supply window suited to many deployed systems.

Key Features

• Programmable Fabric A logic capacity of 326,080 logic elements supports large, complex designs and custom hardware implementation.
• Embedded Memory Approximately 16.4 Mbits of on‑chip RAM for buffering, state storage, and data processing tasks.
• I/O Capability Up to 500 user I/O pins to support multiple parallel interfaces, sensors, and external peripherals.
• Package & Mounting 900‑ball FCBGA (900‑BBGA) in a 31 × 31 mm supplier device package; designed for surface‑mount assembly.
• Power Core voltage supply range of 0.970 V to 1.03 V to match system power rails and regulator designs.
• Temperature & Grade Industrial grade operation with an operating temperature range of −40 °C to 100 °C for deployed systems.
• Environmental Compliance RoHS‑compliant construction for regulatory and environmental considerations.

Typical Applications

• Industrial Control Systems — Implement custom logic, I/O aggregation, and real‑time processing using the device's large logic capacity and extensive I/O.
• Communications Infrastructure — Use the abundant logic and embedded memory for packet processing, protocol adaptation, and interface bridging.
• Test & Measurement Equipment — Leverage on‑chip RAM and high I/O counts for data capture, preprocessing, and instrument control.

Unique Advantages

• High Logic Density: 326,080 logic elements enable consolidation of complex functions into a single FPGA, simplifying board design.
• Significant Embedded Memory: Approximately 16.4 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O Count: 500 user I/O pins provide flexibility to connect numerous peripherals, sensors, and interface standards without extra components.
• Compact SMD Package: 900‑FCBGA (31×31 mm) delivers a high‑capacity device in a space‑efficient surface‑mount footprint.
• Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in a wide range of environmental conditions.
• Regulatory Compliance: RoHS‑compliant construction supports environmental and manufacturing requirements.

Why Choose XC7K325T-L2FFG900I?

The XC7K325T-L2FFG900I positions itself as a high‑capacity Kintex®‑7 FPGA option for industrial applications that require substantial programmable logic, on‑chip memory, and plentiful I/O in a compact package. Its combination of 326,080 logic elements, approximately 16.4 Mbits of embedded RAM, and 500 user I/O makes it suitable for engineers consolidating complex digital functions on a single device.

Backed by AMD’s FPGA product family, this device offers a balance of integration and deployment readiness for industrial systems, test equipment, and communications infrastructure where long‑term availability and robust operating range are important.

Request a quote or submit a pricing inquiry for the XC7K325T-L2FFG900I to receive availability and lead‑time information tailored to your project needs.