XC7K325T-L2FBG900I

The XC7K325T-L2FBG900I is a Kintex®-7 Field Programmable Gate Array (FPGA) from AMD designed for industrial-grade applications that require high logic capacity and substantial on-chip memory. It delivers a large programmable fabric combined with a wide I/O count and a compact 900‑ball FCBGA package for space-constrained board designs.

This device is suited for systems that need abundant logic resources, embedded memory, and a robust operating range, enabling deployment in demanding industrial environments.

Key Features

• Logic Capacity — Provides 326,080 logic elements to implement complex digital designs and large-scale logic integration.
• Embedded Memory — Approximately 16.4 Mbits of on-chip RAM to support data buffering, state storage, and memory-intensive functions without external RAM.
• I/O Density — 500 user I/O pins to connect a broad range of peripherals, interfaces, and board-level signals.
• Power — Core voltage supply range of 0.97–1.03 V to match system power rails and design constraints.
• Package & Mounting — 900‑ball FCBGA package (900‑FCBGA, 31×31) in a surface-mount format for compact system integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• RoHS Compliant — Manufactured to meet RoHS environmental requirements.

Typical Applications

• Industrial Control — Implement motor control, machine automation logic, and deterministic control systems leveraging high logic density and wide temperature operation.
• Communications & Networking — Use on-chip memory and abundant I/O to handle protocol bridging, packet buffering, and interface aggregation in networking equipment.
• Embedded Systems & Prototyping — Deploy as a central programmable fabric for prototype platforms or embedded designs that require flexible logic and memory resources.
• Test and Measurement — Integrate logic-intensive data acquisition and preprocessing functions while maintaining a compact board footprint.

Unique Advantages

• High Logic Integration: 326,080 logic elements enable consolidation of multiple functions into a single FPGA, reducing bill-of-materials and board complexity.
• Substantial On-Chip Memory: Approximately 16.4 Mbits of embedded RAM supports buffering and localized data storage, minimizing dependence on external memory.
• Flexible I/O Count: 500 I/O pins provide the connectivity needed for complex multi-interface designs and high-density board layouts.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a robust FCBGA package suitable for industrial deployments.
• Compact Packaging: The 900‑FCBGA (31×31) surface-mount package balances high resource density with a small PCB footprint for space-constrained applications.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product designs and regulatory needs.

Why Choose XC7K325T-L2FBG900I?

XC7K325T-L2FBG900I combines a large programmable fabric and significant embedded memory in an industrial-grade Kintex®-7 FPGA package, offering a practical balance of performance, integration, and environmental robustness. Its combination of logic density, on-chip RAM, and abundant I/O makes it well suited for engineers building complex industrial control, communications, and embedded systems where board space and thermal performance are considerations.

As an AMD-manufactured Kintex®-7 device, it provides designers with a high-capacity FPGA option that supports long-term deployment needs through RoHS compliance and a wide operating temperature range.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for XC7K325T-L2FBG900I. Our team can assist with volume pricing and delivery options to support your design schedule.