XC7K325T-L2FBG900E

The XC7K325T-L2FBG900E is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD designed for applications that require large programmable logic capacity and substantial on-chip memory. It combines 326,080 logic elements with approximately 16.4 Mbits of embedded memory and a 500-pin I/O count in a 900-FCBGA package to support complex digital designs.

Key Features

• Logic Capacity  326,080 logic elements to implement large-scale custom logic and control functions.
• Embedded Memory  Approximately 16.4 Mbits of on-chip RAM for buffering, state storage, and data processing.
• I/O  500 I/O pins to support multiple parallel interfaces and high-density connectivity.
• Power  Core voltage supply range of 970 mV to 1.03 V to match system power rail requirements.
• Package & Mounting  900-FCBGA (31 × 31) package in a surface-mount form factor for compact board-level integration.
• Temperature & Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C.
• Compliance  RoHS-compliant construction for environmental regulatory alignment.

Typical Applications

• Custom digital processing  Implement application-specific datapaths and control logic using the large logic element count and embedded memory.
• I/O-intensive interfacing  Support multiple parallel and serial interfaces with the 500 available I/O pins for complex system integration.
• On-chip buffering and state machines  Use approximately 16.4 Mbits of embedded RAM for packet buffering, FIFOs, and finite-state machines.

Unique Advantages

• High logic density: 326,080 logic elements enable consolidation of large or multiple functions into a single device, reducing board-level BOM complexity.
• Substantial embedded memory: Approximately 16.4 Mbits of on-chip RAM supports local buffering and reduces external memory requirements.
• Generous I/O capacity: 500 I/O pins accommodate extensive peripheral and interface connectivity without additional I/O expanders.
• Compact, serviceable package: 900-FCBGA (31×31) surface-mount package provides a high-density solution for space-constrained PCBs.
• Extended operating range: Rated for 0 °C to 100 °C operation and designated Extended grade for broad environmental use within that range.
• Regulatory alignment: RoHS-compliant construction supports regulatory and manufacturing requirements.

Why Choose XC7K325T-L2FBG900E?

The XC7K325T-L2FBG900E positions itself as a high-capacity Kintex®-7 FPGA option for designs that need significant logic resources, on-chip RAM, and a large I/O complement in a compact FCBGA package. Its combination of 326,080 logic elements, approximately 16.4 Mbits of embedded memory, and 500 I/O pins makes it suitable for consolidating complex digital functions and reducing external component count.

This device is well suited for engineering teams and procurement sourcing platforms seeking a surface-mount, RoHS-compliant FPGA with extended-grade temperature support and a defined core voltage range. Technical documentation for the Kintex-7 family is available for deeper integration and validation during development.

Request a quote or submit an inquiry to receive pricing, availability, and ordering details for the XC7K325T-L2FBG900E.