XC7K325T-3FFG676E

The XC7K325T-3FFG676E is a Kintex®-7 field programmable gate array (FPGA) IC designed for applications requiring high logic density, substantial embedded memory, and flexible I/O. This surface-mount FCBGA device integrates 326,080 logic elements, approximately 16.4 Mbits of on-chip RAM, and 400 general-purpose I/O to support complex digital designs.

Offered in a 676-FCBGA (27×27) package and rated for extended-grade operation from 0 °C to 100 °C, the device operates with a core supply range of 0.970 V to 1.03 V and is RoHS compliant.

Key Features

• Core Logic 326,080 logic elements for implementing large-scale digital functions and custom hardware accelerators.
• Embedded Memory Approximately 16.4 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate data storage.
• I/O Capacity 400 user I/O pins to interface with sensors, peripherals, and external memory or logic devices.
• Power Supply Core voltage operating range from 0.970 V to 1.03 V for compatibility with low-voltage system designs.
• Package & Mounting 676-ball FCBGA (27×27) surface-mount package for high-density board-level integration.
• Operating Range & Grade Extended-grade device specified for 0 °C to 100 °C operation to suit a variety of commercial and industrial-adjacent environments.
• Compliance RoHS compliant, supporting environmentally conscious manufacturing requirements.

Typical Applications

• Digital Signal Processing Implement real-time filtering, transforms, and custom DSP pipelines using the device's abundant logic elements and embedded RAM.
• High-Density Prototyping Use as a platform for validating large-scale digital designs that require significant programmable logic and on-chip memory.
• Communications and Networking Deploy in communication equipment where flexible I/O and large logic resources enable protocol engines and packet processing.
• Imaging and Sensor Systems Manage data aggregation, preprocessing, and control logic for imaging pipelines leveraging high I/O count and embedded memory.

Unique Advantages

• High Logic Density: 326,080 logic elements provide the capacity to implement complex state machines, datapaths, and custom accelerators without external logic.
• Substantial On-Chip Memory: Approximately 16.4 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage, simplifying board design.
• Generous I/O Count: 400 I/O pins enable broad interfacing options for multi-channel systems and high-pin-count peripherals.
• Compact, Surface-Mount Package: The 676-FCBGA (27×27) package supports high-density PCB layouts while maintaining robust electrical connections.
• Extended Temperature Rating: Rated for 0 °C to 100 °C operation to meet the demands of a wide range of deployments.
• RoHS Compliance: Built to meet environmental regulations for lead-free manufacturing.

Why Choose XC7K325T-3FFG676E?

The XC7K325T-3FFG676E positions itself as a high-capacity, flexible FPGA solution for engineers who need substantial on-chip logic and memory along with a large I/O complement in a compact FCBGA package. Its extended-grade temperature rating and RoHS compliance make it suitable for long-lived designs that demand reliability and regulatory alignment.

This device is well suited to designers building complex digital processing systems, communications equipment, imaging pipelines, and advanced prototyping platforms that benefit from scalable programmable logic and embedded memory resources.

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