XC7K325T-2FFG900I

The XC7K325T-2FFG900I is a Kintex®-7 field programmable gate array (FPGA) IC from AMD designed for high‑density, reconfigurable digital logic implementations. It combines a large logic fabric with substantial on‑chip memory and a high I/O count to address complex, multi‑interface designs.

This industrial‑grade device provides 326,080 logic elements and approximately 16.4 Mbits of embedded memory, along with 500 user I/O pins, a 900‑ball FCBGA package (31×31), and an operating range that supports −40 °C to 100 °C environments, making it suitable for demanding embedded and industrial applications.

Key Features

• Core Logic 326,080 logic elements provide a substantial programmable fabric for implementing complex digital functions, parallel processing, and custom accelerators.
• Embedded Memory Approximately 16.4 Mbits of on‑chip RAM to support data buffering, look‑up tables, and state storage without external memory for many use cases.
• I/O Capacity 500 user I/O pins enable broad connectivity to peripherals, sensors, transceivers, and multiple high‑speed interfaces.
• Power Supply Core voltage range of 0.97 V to 1.03 V to match system power rails and support stable core operation within specified limits.
• Package & Mounting 900‑FCBGA (31×31) package in a surface‑mount format for compact board integration and high‑density routing.
• Temperature & Grade Industrial grade operation from −40 °C to 100 °C for use in temperature‑challenging environments.
• RoHS Compliant Environmentally compliant with RoHS requirements for regulated manufacturing and deployment.

Typical Applications

• High‑density digital signal processing — Use the large logic fabric and embedded memory for data‑intensive DSP tasks and algorithm acceleration.
• Multi‑interface system hubs — High I/O count supports aggregation and bridging of multiple interfaces and peripheral buses in a single device.
• Industrial control and automation — Industrial temperature rating and robust packaging suit control, monitoring, and real‑time processing applications.
• Custom compute acceleration — Implement hardware accelerators for compute‑heavy operations using the FPGA’s configurable logic and on‑chip RAM.

Unique Advantages

• High logic density: 326,080 logic elements enable complex designs and significant parallelism within a single device, reducing the need for multiple FPGAs.
• Substantial embedded memory: Approximately 16.4 Mbits of on‑chip RAM simplifies buffering and stateful designs without immediate dependence on external memory.
• Extensive I/O capability: 500 user I/Os provide flexible connectivity for multi‑channel data paths and mixed‑signal system integration.
• Industrial temperature range: Rated for −40 °C to 100 °C operation to meet the environmental demands of industrial deployments.
• Compact, board‑friendly package: 900‑FCBGA (31×31) surface‑mount package balances pin density with board integration for space‑constrained systems.
• Regulatory readiness: RoHS compliance supports environmentally regulated manufacturing and product acceptance.

Why Choose XC7K325T-2FFG900I?

The XC7K325T-2FFG900I positions itself as a high‑capacity, industrial‑grade FPGA that balances large programmable resources, ample embedded memory, and wide I/O flexibility within a compact 900‑ball FCBGA package. Its specified core voltage range and operating temperature make it suitable for designs that require reliable operation across varied industrial environments.

This device is well suited to system designers and OEMs building complex embedded systems that need scalable logic capacity, substantial on‑chip RAM, and extensive connectivity while maintaining RoHS compliance and board‑level integration simplicity.

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