XC7K325T-2FF900I

The XC7K325T-2FF900I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC supplied in a 900-FCBGA package. It offers a large logic fabric with 326,080 logic elements and approximately 16.4 Mbits of embedded memory to support complex, resource-intensive designs.

Designed for surface-mount applications, this industrial-grade device provides up to 500 I/O, operates across a core supply range of 970 mV to 1.03 V, and supports an operating temperature range of −40 °C to 100 °C. RoHS compliance is included.

Key Features

• Core Capacity 326,080 logic elements to implement large-scale digital logic and custom architectures.
• Embedded Memory Approximately 16.4 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Count Up to 500 programmable I/O pins to interface with sensors, peripherals, and external controllers.
• Power Core supply range from 970 mV to 1.03 V for defined power-domain integration.
• Package & Mounting 900-FCBGA package (900-BBGA, supplier package 900-FCBGA (31x31)) in a surface-mount form factor for compact board layouts.
• Temperature & Grade Industrial-grade device rated for −40 °C to 100 °C operation.
• Compliance RoHS compliant for environmental regulatory alignment.

Unique Advantages

• Large logic resource pool: 326,080 logic elements enable implementation of complex custom logic and wide parallel processing pipelines.
• Substantial on-chip memory: Approximately 16.4 Mbits of embedded RAM reduces the need for external memory in many designs.
• High I/O density: 500 I/O pins allow flexible interfacing options for multi-channel systems and mixed-signal front ends.
• Industrial temperature support: Specified operation from −40 °C to 100 °C for deployment in demanding thermal environments.
• Compact FCBGA footprint: 900-FCBGA (31x31) surface-mount package supports space-constrained PCB designs while maintaining high integration.
• Regulatory alignment: RoHS compliance supports environmentally responsible manufacturing and procurement.

Why Choose XC7K325T-2FF900I?

The XC7K325T-2FF900I combines a large logic fabric, significant embedded memory, and a high I/O count in a compact surface-mount FCBGA package, making it suitable for complex digital designs that require on-chip capacity and flexible interfacing. Its industrial temperature rating and RoHS compliance support deployment where environmental robustness and regulatory alignment are required.

This device is appropriate for designers and teams targeting solutions that need substantial programmable logic and memory resources, a defined core supply range, and a compact package for board-level integration.

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