XC7K325T-2FBG900I

The XC7K325T-2FBG900I is an AMD Kintex®-7 field programmable gate array (FPGA) supplied in a 900-FCBGA (31 × 31) package. It delivers a high-density programmable logic fabric with substantial on-chip memory and broad I/O capacity for designs that require large-scale integration in an industrial-grade device.

With 326,080 logic elements, approximately 16.4 Mbits of embedded memory and 500 I/O pins, this device targets applications that need a combination of logic capacity, memory resources and extensive connectivity while supporting surface-mount assembly and extended temperature operation.

Key Features

• Core / Logic  Provides 326,080 logic elements and 25,475 CLBs for implementing complex digital logic and custom processing pipelines.
• Embedded Memory  Approximately 16.4 Mbits of on-chip RAM to support buffer storage, FIFOs and local data processing without external memory in many use cases.
• I/O and Connectivity  Up to 500 I/O pins to support dense peripheral interfacing and multi-channel signal routing.
• Power Supply  Operates from a core supply range of 970 mV to 1.03 V to match system power-rail requirements.
• Package and Mounting  900-FCBGA (31 × 31) supplier device package; surface-mount FCBGA package case (900-BBGA, FCBGA) for compact, high-density PCB layouts.
• Temperature Range  Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control and Automation  Use in control systems and PLCs where industrial temperature range and high logic density support demanding control algorithms and I/O integration.
• High-Density I/O Systems  Ideal for designs that require up to 500 I/O connections for interfacing multiple sensors, actuators or communication ports.
• Memory-Intensive FPGA Designs  Suitable for functions that rely on substantial on-chip RAM (approximately 16.4 Mbits) such as buffering, data aggregation or packet processing.

Unique Advantages

• High Logic Capacity: 326,080 logic elements enable large, complex logic implementations and deep customization of system functions.
• Substantial On-Chip Memory: Approximately 16.4 Mbits of embedded RAM reduces dependence on external memory for many workloads, simplifying board design.
• Extensive I/O Count: 500 I/O pins provide the flexibility to connect numerous peripherals and I/O standards within a single FPGA device.
• Industrial Temperature Robustness: Specified operation from −40 °C to 100 °C supports deployment in demanding environmental conditions.
• Compact, High-Density Package: 900-FCBGA (31 × 31) package allows dense PCB implementations while maintaining large logic and memory resources.
• Regulatory Compliance: RoHS compliance aligns the device with common environmental and manufacturing requirements.

Why Choose XC7K325T-2FBG900I?

The XC7K325T-2FBG900I pairs high logic element count and significant embedded memory with a large I/O complement in a compact FCBGA package, delivering a balanced platform for designs that require integration of complex logic, local memory and extensive connectivity. Its industrial temperature rating and RoHS compliance make it appropriate for applications that demand reliable operation in challenging environments.

This Kintex-7 FPGA is suitable for engineering teams developing control systems, I/O-dense platforms and memory-intensive logic functions who need a robust, high-density programmable device. Refer to the Kintex-7 series documentation for additional design and implementation details.

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