XC7K325T-1FFV900I

The XC7K325T-1FFV900I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC offering large programmable logic capacity, significant embedded memory, and a high I/O count in a 900-ball FCBGA package. The device is specified for industrial-grade applications and operates across a wide temperature range.

With 326,080 logic elements and approximately 16.4 Mbits of on-chip RAM, this FPGA targets designs that require dense logic integration, substantial embedded memory, and extensive external connectivity while meeting industrial temperature requirements.

Key Features

• Core Logic Capacity 326,080 logic elements for implementing complex programmable logic and custom functions.
• Embedded Memory Approximately 16.4 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Density Up to 500 I/O pins to support high channel counts and multiple external interfaces.
• Power Supply Specified voltage supply range of 970 mV to 1.03 V to match system power rails and core requirements.
• Package & Mounting 900-ball FCBGA (900-FCBGA, 31×31) surface-mount package for dense board-level integration.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, supporting deployment in industrial environments.
• Manufacturer AMD Kintex‑7 architecture—device designation consistent with the Kintex‑7 family.
• RoHS Compliance RoHS-compliant to support lead-free manufacturing processes.

Typical Applications

• High-density digital systems — Use the device where large programmable logic capacity and on-chip memory are required to implement complex control and processing tasks.
• Multi-channel I/O solutions — Leverage up to 500 I/Os for designs that need extensive external connectivity or multiple parallel interfaces.
• Embedded acceleration and buffering — Employ the approximately 16.4 Mbits of embedded RAM for local data storage, packet buffering, or intermediate processing stages.

Unique Advantages

• High logic density: 326,080 logic elements enable consolidation of complex functions into a single programmable device.
• Significant on-chip memory: Approximately 16.4 Mbits of RAM reduces reliance on external memory and improves data locality.
• Extensive I/O capability: Up to 500 I/Os support broad connectivity and simplify board-level design for multi-interface systems.
• Industrial-grade thermal range: −40 °C to 100 °C rating supports deployment in demanding temperature environments.
• Compact, surface-mount package: 900-FCBGA (31×31) provides a high-density footprint for space-constrained boards.
• Standards-compliant supply: Defined voltage range (970 mV–1.03 V) helps ensure predictable power integration at the system level.

Why Choose XC7K325T-1FFV900I?

The XC7K325T-1FFV900I combines a substantial logic element count, meaningful embedded memory, and a high I/O complement in a compact 900-ball FCBGA package rated for industrial temperatures. It is well suited for designs that demand dense programmable logic, local memory resources, and broad external connectivity.

Choosing this Kintex‑7 FPGA delivers a balanced platform for engineers and procurement teams seeking a validated industrial-grade device with clearly defined electrical and thermal specifications for integration into complex systems.

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