XC7K325T-2FBG676C

The XC7K325T-2FBG676C is a Kintex®-7 field programmable gate array (FPGA) manufactured by AMD, delivered in a 676-FCBGA package. It provides a combination of high logic density and significant embedded memory capacity for advanced programmable designs.

With 326,080 logic elements, approximately 16.4 Mbits of on-chip RAM and 400 I/O, this device is tailored for designs that require substantial programmable logic, embedded memory resources and flexible I/O in a surface-mount FCBGA package.

Key Features

• Logic Capacity — 326,080 logic elements and 25,475 CLBs provide large programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 16.4 Mbits of total on-chip RAM to support data buffering, FIFOs and embedded storage requirements.
• I/O Count — 400 I/O pins enable broad external interfacing options for peripherals, high-speed links or parallel buses.
• Power Supply — Core voltage specified from 970 mV to 1.03 V to match system power domains and regulator choices.
• Package & Mounting — 676-FCBGA package (27×27) in a surface-mount form factor for compact board-level integration.
• Operating Range & Grade — Commercial grade device specified for 0°C to 85°C operating temperature.
• Environmental Compliance — RoHS compliant for alignment with lead-free manufacturing requirements.

Typical Applications

• Logic-Intensive Designs — Use the large logic element pool to implement complex state machines, datapaths and custom processing pipelines.
• Memory-Centric Functions — Leverage the embedded memory (~16.4 Mbits) for buffering, packet storage or intermediate data staging.
• Custom I/O Interfaces — 400 general-purpose I/Os support diverse interfacing needs including parallel buses and custom signaling.

Unique Advantages

• High Logic Density: 326,080 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Significant On-Chip Memory: Approximately 16.4 Mbits of embedded RAM helps minimize external memory dependencies and simplifies memory management.
• Flexible I/O Capacity: 400 I/Os provide room for extensive peripheral connectivity without immediate need for expansion devices.
• Compact, Surface-Mount Packaging: The 676-FCBGA (27×27) package supports dense PCB layouts while maintaining a standardized ball-grid format for assembly.
• Commercial Temperature Range: Rated 0°C to 85°C to align with standard commercial electronic applications and environments.

Why Choose XC7K325T-2FBG676C?

The XC7K325T-2FBG676C places substantial programmable logic and embedded memory into a single, surface-mount 676-FCBGA package, making it a practical choice for designs that require consolidation of complex digital functions and on-chip storage. Its 400 I/Os and defined core voltage range give designers concrete hardware parameters to design around.

This device is suitable for teams and projects that prioritize logic density, embedded RAM capacity and compact board integration within a commercial temperature envelope. Backed by AMD's Kintex®-7 family lineage, it offers a predictable resource set for medium-to-large FPGA-based implementations.

Request a quote or submit a procurement inquiry to check availability and pricing for the XC7K325T-2FBG676C.