XC7K325T-1FFG900CES
| Part Description |
Kintex®-7 Field Programmable Gate Array (FPGA) IC 500 16404480 326080 900-BBGA, FCBGA |
|---|---|
| Quantity | 1,181 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 900-FCBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 900-BBGA, FCBGA | Number of I/O | 500 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 25475 | Number of Logic Elements/Cells | 326080 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 16404480 |
Overview of XC7K325T-1FFG900CES – Kintex®-7 FPGA, 326,080 logic elements, 500 I/Os
The XC7K325T-1FFG900CES is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD. It delivers 326,080 logic elements, approximately 16.4 Mbits of embedded memory, and a 500-pin I/O capacity in a 900-FCBGA surface-mount package. This commercial-grade FPGA is specified with a core voltage range of 970 mV to 1.03 V and an operating temperature range of 0 °C to 85 °C.
Key Features
- Programmable Logic Capacity 326,080 logic elements provide substantial on-chip programmable logic for complex designs.
- Embedded Memory Approximately 16.4 Mbits of on-chip RAM to support buffering, state machines, and local data storage.
- I/O Resources 500 available I/O pins to accommodate a wide range of external interfaces and high-pin-count connectivity.
- Power Core supply range specified at 970 mV to 1.03 V for consistent power planning and design integration.
- Package & Mounting 900-FCBGA (31×31) package, 900-BBGA format, designed for surface-mount assembly in dense board layouts.
- Temperature & Grade Commercial-grade device rated for 0 °C to 85 °C operation.
- Compliance RoHS compliant to support regulatory-driven design requirements.
Unique Advantages
- High logic density: 326,080 logic elements enable implementation of large-scale programmable designs without immediate external logic expansion.
- Substantial embedded memory: Approximately 16.4 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage needs.
- Extensive I/O capability: 500 I/Os support multiple parallel interfaces, sensor arrays, and high-pin-count peripheral connectivity.
- Compact, surface-mount package: 900-FCBGA (31×31) packaging supports space-constrained PCBs while maintaining high pin density.
- Defined power envelope: Core voltage range of 970 mV to 1.03 V simplifies power supply design for the FPGA core.
- Commercial-grade and RoHS compliant: Designed for commercial applications with environmental compliance for many global markets.
Why Choose XC7K325T-1FFG900CES?
The XC7K325T-1FFG900CES balances high logic capacity, significant embedded memory, and a large I/O complement in a compact 900-FCBGA package. As a Kintex®-7 family device from AMD, it provides a platform for designs that require substantial programmable logic and on-chip resources within commercial temperature and power specifications.
This device is suited for projects that need scalable logic density and high I/O count while maintaining a defined core voltage and commercial operating range. Its RoHS compliance and surface-mount package support standard manufacturing and regulatory needs for commercial products.
Request a quote or submit an inquiry to receive pricing and availability information for the XC7K325T-1FFG900CES.
Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH
