XC7K325T-1FFG900CES9937

The XC7K325T-1FFG900CES9937 is a Kintex®-7 Field Programmable Gate Array (FPGA) IC manufactured by AMD, supplied in a 900-FCBGA package. It delivers a large on-chip resource set including 326,080 logic elements, approximately 16.4 Mbits of embedded memory, and 500 I/O.

Designed as a commercial-grade, surface-mount FPGA, the device operates with a nominal supply range of 970 mV to 1.03 V and an ambient temperature rating of 0 °C to 85 °C, making it suitable for a wide range of general-purpose electronic systems requiring high logic density and substantial embedded memory.

Key Features

• Core Architecture: Kintex®-7 FPGA family device from AMD, optimized for programmable logic integration and system-level implementation.
• Logic Resources: 326,080 logic elements and 25,475 CLBs provide extensive programmable fabric for complex digital designs.
• Embedded Memory: Approximately 16.4 Mbits of on-chip RAM to support buffering, data storage, and intermediate processing tasks.
• I/O Count: 500 I/O pins to accommodate broad interfacing requirements and multiple external peripherals.
• Power Supply: Operates within a supply range of 970 mV to 1.03 V, enabling defined power-domain design and integration.
• Package & Mounting: 900-FCBGA (31x31) package in a surface-mount format for high-density board integration.
• Operating Grade & Temperature: Commercial grade with an operating range of 0 °C to 85 °C for mainstream electronic applications.
• RoHS Compliance: RoHS status compliant.

Unique Advantages

• High logic capacity: 326,080 logic elements and 25,475 CLBs enable implementation of large-scale digital logic and complex algorithms on a single device.
• Substantial on-chip memory: Approximately 16.4 Mbits of embedded RAM reduces external memory dependence for many buffering and data-path needs.
• Generous I/O provisioning: 500 I/O pins support extensive peripheral connectivity and multi-channel interfaces without external expanders.
• Compact, production-ready packaging: 900-FCBGA surface-mount package supports high-density PCB designs and established assembly processes.
• Commercial operating range: 0 °C to 85 °C rating aligns with a wide range of non-industrial system deployments.
• Regulatory readiness: RoHS compliance simplifies environmental conformity for shipped products.

Why Choose XC7K325T-1FFG900CES9937?

The XC7K325T-1FFG900CES9937 combines a large quantity of programmable logic, significant embedded memory, and a high I/O count in a single 900-FCBGA surface-mount package. These attributes make it a practical choice for designs that require on-chip capacity for complex digital functions and substantial interfacing within a commercial temperature range.

Backed by the Kintex®-7 architecture from AMD, this FPGA delivers a balance of integration and resource density that supports scalable system designs while simplifying board-level integration and BOM considerations.

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