XC7K325T-1FFG676I

The XC7K325T-1FFG676I is a Kintex®-7 field programmable gate array (FPGA) offered by AMD, delivering high logic density and significant on‑chip memory capacity in a 676‑ball FCBGA package. It is designed for systems that require a large number of logic elements, abundant embedded RAM, and extensive I/O in an industrial‑grade component.

This device combines 326,080 logic elements, approximately 16.4 Mbits of embedded memory and up to 400 I/O pins, providing a platform for complex digital designs that must operate across a wide supply and temperature range.

Key Features

• Core Density  326,080 logic elements to support large-scale programmable logic implementations and complex combinational/sequential designs.
• Embedded Memory  Approximately 16.4 Mbits of on‑chip RAM for buffering, LUT-based memory, and fast local data storage.
• I/O Capacity  Up to 400 I/O pins to accommodate wide external interfaces and multi-channel connectivity.
• Power Supply  Operates over a core voltage range of 970 mV to 1.03 V, enabling designs that require tight core-voltage control.
• Package & Mounting  676‑ball FCBGA package (27 × 27 mm) in a surface‑mount form factor for compact board integration.
• Temperature Range  Industrial operating temperature from −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑density digital processing  Use the large logic element count and embedded memory to implement complex signal processing, algorithm acceleration, and custom datapaths.
• Multi‑channel I/O systems  Leverage up to 400 I/O pins to interface with many sensors, peripherals, or serial lanes in a single device.
• Industrial control and automation  Industrial temperature rating and robust packaging make this FPGA suitable for control logic, real‑time processing, and system orchestration in industrial equipment.

Unique Advantages

• High logic integration: Large logic element capacity reduces the need for multiple devices, simplifying board layout and BOM.
• Substantial on‑chip memory: Approximately 16.4 Mbits of embedded RAM provides local buffering and fast access for latency‑sensitive designs.
• Extensive I/O resources: Up to 400 I/Os enable flexible interfacing with a wide range of external components and high channel counts.
• Industrial temperature support: Rated for −40 °C to 100 °C to maintain operation across extended environmental conditions.
• Compact FCBGA packaging: 676‑ball FCBGA (27 × 27 mm) offers a high‑density footprint for space‑constrained system designs.
• RoHS compliant: Meets environmental regulation requirements for lead‑free manufacturing processes.

Why Choose XC7K325T-1FFG676I?

The XC7K325T-1FFG676I positions itself as a high‑capacity, industrial‑grade Kintex®‑7 FPGA suitable for engineers building complex digital systems that demand abundant logic resources, on‑chip memory, and extensive I/O. Its core voltage and temperature specifications support deployment in controlled power environments and across a wide operating range.

This device is appropriate for development teams and integrators who need a single FPGA solution to consolidate multiple functions, reduce board complexity, and maintain performance and reliability in industrial settings.

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