XC7K325T-1FF900I

The XC7K325T-1FF900I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 900-ball FCBGA package. It provides a high logic-capacity FPGA fabric with substantial embedded memory and a large I/O complement for complex, high-density programmable designs.

With 326,080 logic elements and approximately 16.4 Mbits of on-chip RAM, this device targets designs that require significant programmable logic, embedded memory and broad I/O connectivity within an industrial temperature range.

Key Features

• FPGA Core Kintex®-7 Field Programmable Gate Array architecture presented in the XC7K325T-1FF900I device.
• Logic Capacity 326,080 logic elements and 25,475 configurable logic blocks (CLBs) for implementing large digital functions.
• Embedded Memory Approximately 16.4 Mbits of total on-chip RAM to support buffering, state storage and memory-intensive logic.
• I/O Count 500 user I/O pins to support extensive peripheral and bus connectivity.
• Power Core supply voltage range of 970 mV to 1.03 V for the device core.
• Package 900-ball FCBGA (900-FCBGA, 31×31) in a 900-BBGA/FCBGA package case; surface-mount mounting type.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
• Compliance RoHS-compliant component.

Typical Applications

• High-density digital processing — Implement complex logic functions and custom datapaths using the 326,080 logic elements and extensive CLB resources.
• Memory-intensive embedded systems — Use approximately 16.4 Mbits of on-chip RAM for packet buffering, frame storage or intermediate data processing.
• Large I/O systems — Support multi-channel interfaces and broad peripheral connectivity with 500 user I/O pins.

Unique Advantages

• High logic integration: 326,080 logic elements enable large, consolidated FPGA designs and reduce the need for multiple devices.
• Significant embedded memory: Approximately 16.4 Mbits of on-chip RAM supports data buffering and memory-hungry algorithm implementation without external RAM for many designs.
• Extensive I/O capacity: 500 I/O pins accommodate high channel counts and complex interconnect requirements.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
• Compact FCBGA package: 900-FCBGA (31×31) provides a high-pin-count solution in a surface-mount package optimized for dense board layouts.
• RoHS compliant: Meets environmental regulatory requirements for lead-free assembly.

Why Choose XC7K325T-1FF900I?

The XC7K325T-1FF900I combines a high count of logic elements, substantial embedded RAM and a large I/O complement in an industrial-grade FPGA package. This combination makes it suitable for designers who need to implement complex, memory-aware digital systems within a single, compact FPGA footprint.

Engineers targeting high-density logic, extensive interfacing and robust thermal performance will find the XC7K325T-1FF900I delivers scalable capacity and the physical I/O and package characteristics required for demanding applications.

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