XC7K325T-1FBG900C

The XC7K325T-1FBG900C is a Kintex®-7 Field Programmable Gate Array (FPGA) from AMD. It integrates 326,080 logic elements and 25,475 CLBs with approximately 16.4 Mbits of embedded memory and up to 500 user I/O in a 900-FCBGA (31×31) surface-mount package.

Targeted for commercial-grade designs that require high logic capacity, significant on-chip memory, and broad I/O connectivity, this device operates from a core supply range of 0.970 V to 1.03 V and across an operating temperature range of 0 °C to 85 °C.

Key Features

• Core logic 326,080 logic elements and 25,475 configurable logic blocks (CLBs) for implementing complex programmable logic.
• Embedded memory Approximately 16.4 Mbits of on-chip RAM to support local data storage and buffering.
• I/O capacity 500 user I/O pins to accommodate wide peripheral and interface needs.
• Power Core supply voltage range of 0.970 V to 1.03 V for defined power-domain design.
• Package and mounting 900-FCBGA (31×31) package case (900-BBGA, FCBGA), surface-mount for compact board integration.
• Operating grade and temperature Commercial grade device specified for 0 °C to 85 °C operation.
• Environmental compliance RoHS-compliant.

Unique Advantages

• High logic density: 326,080 logic elements enable substantial programmable capacity within a single device.
• Significant embedded memory: Approximately 16.4 Mbits of on-chip RAM reduces dependence on external memory for many designs.
• Wide I/O complement: 500 user I/O pins provide flexibility for multiple interfaces and peripherals.
• Compact FCBGA footprint: 900-FCBGA (31×31) surface-mount package supports dense board layouts and system integration.
• Defined electrical and thermal envelope: Specified core voltage range and commercial operating temperature simplify power and thermal planning.
• RoHS compliance: Meets common lead-free and environmental requirements for commercial products.

Why Choose XC7K325T-1FBG900C?

The XC7K325T-1FBG900C combines a large programmable fabric, substantial on-chip memory, and a high I/O count in a compact 900-FCBGA package, providing a balanced solution for commercial designs that need significant logic and connectivity on a single device. Its defined core voltage range and commercial temperature rating make it suitable for applications with established power and thermal requirements.

This FPGA is well suited for design teams seeking a scalable, integrated programmable device from AMD that delivers capacity and connectivity while simplifying board-level integration and component selection.

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