XC7K325T-1FB676I

The XC7K325T-1FB676I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC in a 676‑ball FCBGA package. It delivers a high density of programmable logic, on-chip memory, and I/O resources in an industrial-grade device engineered for surface-mount applications.

Key on-chip resources include 326,080 logic elements, approximately 16.4 Mbits of embedded memory, and 400 I/O pins. The device operates across a core supply range of 0.970 V to 1.03 V and supports an operating temperature range of −40 °C to 100 °C.

Key Features

• Programmable Logic 326,080 logic elements provide high-density programmable resources for complex digital designs.
• Embedded Memory Approximately 16.4 Mbits of on-chip RAM to support buffers, FIFOs, and memory-intensive processing.
• I/O Capacity 400 general-purpose I/O pins for broad interfacing options with external peripherals and subsystems.
• Power and Core Voltage Core voltage range of 0.970 V to 1.03 V to match precision power-rail requirements in system designs.
• Package and Mounting 676‑ball FCBGA (27×27) package in a surface-mount form factor for compact board integration.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet demanding thermal environments.
• Regulatory Compliance RoHS compliant to support environmentally conscious manufacturing and assembly.

Typical Applications

• High‑density digital processing — Use the large logic and memory capacity for complex signal processing, protocol handling, and custom acceleration tasks.
• Platform and system controllers — Leverage abundant I/O and programmable logic to implement glue logic, interface bridging, and system orchestration.
• Embedded memory‑centric designs — Approx. 16.4 Mbits of on-chip RAM supports buffering, data staging, and real-time data manipulation within the FPGA fabric.

Unique Advantages

• High logic density: 326,080 logic elements reduce the need for multiple devices, simplifying system architecture and lowering BOM complexity.
• Substantial embedded memory: Approximately 16.4 Mbits of on-chip RAM enables memory-intensive functions without relying solely on external memory.
• Extensive I/O: 400 I/O pins give flexible interfacing options for mixed-signal front ends, sensors, and peripheral buses.
• Industrial operating range: −40 °C to 100 °C qualification supports deployment in thermally demanding environments.
• Compact FCBGA package: 676‑ball (27×27) FCBGA and surface-mount construction allow high integration in space-constrained PCBs.
• RoHS compliant: Designed for environmentally responsible product builds and manufacturing processes.

Why Choose XC7K325T-1FB676I?

The XC7K325T-1FB676I positions itself as a high-density, industrial-grade Kintex®-7 FPGA option that balances substantial logic capacity, significant on-chip memory, and large I/O counts within a compact 676‑FCBGA package. Its defined core voltage range and extended operating temperature make it suitable for robust embedded designs that require predictable power and thermal behavior.

This device is ideal for engineering teams building systems that demand integrated programmable logic, on-chip RAM resources, and flexible interfacing while maintaining industrial temperature tolerance and RoHS compliance. Its combination of resources supports scalability and long-term deployment in engineered systems.

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