XC7K325T-1FB676C

The XC7K325T-1FB676C is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD supplied in a 676-FCBGA (27×27) package. It provides a high logic capacity and sizable on-chip memory in a commercial-grade, surface-mount form factor.

With 326,080 logic elements, approximately 16.4 Mbits of embedded memory, and 400 general-purpose I/O, this device is suited for commercial electronic designs that require significant integration of logic, memory, and I/O within a single FPGA package.

Key Features

• Logic Capacity — 326,080 logic elements (logic cells) to support complex digital designs and implementation of large-scale combinational and sequential logic.
• On-chip Memory — Approximately 16.4 Mbits of embedded RAM for buffering, FIFOs, and storage of intermediate data directly on the device.
• I/O Resources — 400 I/O pins to accommodate wide parallel interfaces, multiple peripherals, or mixed-signal front-end connectivity.
• Package — 676-BBGA / 676-FCBGA (27×27) surface-mount package for high-density board integration.
• Supply Voltage — Core supply range of 970 mV to 1.03 V to match platform power-rail requirements.
• Operating Temperature — Commercial operating range from 0 °C to 85 °C for standard commercial deployments.
• RoHS Compliance — Device is RoHS compliant to support environmental regulations and standard manufacturing requirements.

Typical Applications

• High-density digital systems — Implement large logic functions and custom accelerators that require hundreds of thousands of logic elements and substantial on-chip RAM.
• I/O-rich subsystems — Drive multi-channel interfaces, parallel data paths, or board-level glue logic using the 400 available I/O pins.
• Embedded memory-intensive designs — Use approximately 16.4 Mbits of embedded RAM for packet buffering, lookup tables, or intermediate data storage without external memory.

Unique Advantages

• High logic density: 326,080 logic elements enable consolidation of multiple functions into a single FPGA, reducing component count and board complexity.
• Substantial on-chip RAM: Approximately 16.4 Mbits of embedded memory minimizes dependence on external memory for many buffering and storage needs.
• Extensive I/O: 400 I/O pins provide flexibility for interfacing to many peripherals and parallel buses within a compact package.
• Commercial-grade availability: Designed for commercial applications with an operating range of 0 °C to 85 °C and RoHS compliance for standard production environments.
• Compact, manufacturable package: 676-FCBGA (27×27) surface-mount package supports high-density PCB layouts while maintaining manufacturability.

Why Choose XC7K325T-1FB676C?

The XC7K325T-1FB676C positions itself as a high-capacity Kintex®-7 FPGA option for commercial electronic designs that need a combination of large logic resources, significant embedded memory, and extensive I/O in a single surface-mount package. Its voltage and temperature specifications align with common commercial power and thermal requirements.

This device is suitable for design teams and procurement groups looking to consolidate functionality, reduce board-level component count, and deploy complex digital logic with on-chip RAM and robust I/O capability, all backed by AMD as the manufacturer.

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