XC7K160T-L2FFG676E

The XC7K160T-L2FFG676E is a Kintex®-7 field programmable gate array (FPGA) IC from AMD, offered in a 676-ball FCBGA package. It provides a large logic fabric and substantial on-chip RAM capacity combined with a high I/O count and an extended-grade temperature rating.

Designed for applications that require significant programmable logic, embedded memory and flexible I/O, this device delivers a balance of capacity and integration while operating within a defined core voltage range and surface-mount package constraints.

Key Features

• Programmable logic capacity — 162,240 logic elements to implement complex digital functions and large-scale designs.
• Embedded memory — approximately 11.98 Mbits of on-chip RAM for buffering, data storage and memory-intensive logic tasks.
• I/O resources — 400 I/O pins to support broad peripheral and system interfacing requirements.
• Power supply — specified core voltage range of 870 mV to 930 mV for predictable power planning.
• Package and mounting — 676-FCBGA package (27x27) in a surface-mount form factor for compact PCB integration.
• Operating range and grade — Extended grade with an operating temperature range of 0°C to 100°C for temperature-sensitive deployments.
• Regulatory status — RoHS compliant, meeting common lead-free manufacturing requirements.

Typical Applications

• High-density digital systems — Use the device’s large logic element count and embedded memory to implement complex digital processing and control logic.
• High I/O interface designs — Leverage 400 I/Os to connect to multiple peripherals, sensors, or external devices in dense system designs.
• Embedded memory-centric designs — Apply the approximately 11.98 Mbits of RAM for buffering, local data storage, and temporary data manipulation.

Unique Advantages

• High logic capacity: 162,240 logic elements enable large or partitioned designs without immediate migration to larger families.
• Substantial on-chip memory: Approximately 11.98 Mbits of embedded RAM reduces reliance on external memory for many workloads.
• Generous I/O count: 400 I/Os provide flexibility for multi-interface designs and parallel data paths.
• Compact surface-mount package: 676-FCBGA (27x27) allows dense PCB placement while maintaining high pin count.
• Defined power envelope: Core voltage range of 870 mV–930 mV supports consistent power budgeting and design validation.
• Extended environmental grade: 0°C to 100°C operating range supports deployments within that thermal window.

Why Choose XC7K160T-L2FFG676E?

The XC7K160T-L2FFG676E positions itself as a high-capacity Kintex®-7 FPGA option for designers needing a combination of large programmable logic resources, significant on-chip RAM and a high I/O complement in a surface-mount, FCBGA package. Its extended-grade rating and RoHS compliance support production and manufacturing requirements where those attributes are required.

This device is suitable for development teams and procurement groups targeting scalable FPGA implementations that must balance logic capacity, embedded memory and I/O density within a defined voltage and temperature envelope.

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