XC7K325T-1FF900C

The XC7K325T-1FF900C is a Kintex-7 Field Programmable Gate Array (FPGA) IC from AMD supplied in a 900-FCBGA (31×31) surface-mount package. It combines substantial programmable logic capacity with on-chip RAM and a high I/O count for board-level integration in commercial-grade designs.

Key electrical and environmental parameters are a core voltage supply range of 970 mV to 1.03 V and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• FPGA Family & Package Kintex®-7 Field Programmable Gate Array in a 900-BBGA, FCBGA package; supplier device package specified as 900-FCBGA (31×31) and intended for surface-mount assembly.
• Logic Capacity 326,080 logic elements suitable for complex programmable logic implementations.
• Embedded Memory Approximately 16.4 Mbits of on-chip RAM (16,404,480 bits) to support memory-intensive designs.
• I/O Density 500 I/O pins provide broad connectivity for peripherals and system interfaces.
• Power Core voltage supply range of 970 mV to 1.03 V to define system power requirements.
• Operating Conditions Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Mounting & Compliance Surface mount package and RoHS compliant for regulated-materials requirements.

Typical Applications

• High-density logic designs — Systems that require large programmable logic resources can take advantage of 326,080 logic elements.
• Memory-intensive processing — Designs that need significant on-chip storage can use the device’s approximately 16.4 Mbits of embedded RAM to reduce external memory demand.
• High I/O systems — Applications needing extensive peripheral connectivity or multiple high-bandwidth interfaces can leverage the device’s 500 I/O pins.
• Board-level integration — The 900-FCBGA (31×31) surface-mount package supports compact, high-density PCB layouts.

Unique Advantages

• Substantial programmable resources: 326,080 logic elements enable implementation of complex logic functions without immediate external logic expansion.
• Significant on-chip memory: Approximately 16.4 Mbits of embedded RAM helps lower system BOM by reducing reliance on external memory devices.
• High I/O capacity: 500 I/O pins accommodate multiple peripherals and interfaces directly on-chip.
• Commercial-grade operating range: 0 °C to 85 °C rating fits general-purpose electronic systems.
• Compact FCBGA packaging: 900-FCBGA (31×31) surface-mount package supports dense board-level designs.
• RoHS compliant: Conforms to regulated-materials requirements for modern electronics manufacturing.

Why Choose XC7K325T-1FF900C?

The XC7K325T-1FF900C positions a large pool of programmable logic, significant on-chip RAM, and a high I/O count within a compact 900-FCBGA surface-mount package for commercial-grade applications. Its defined core voltage range and operating temperature make it suitable for general-purpose electronic system designs that require integrated logic and memory resources at the board level.

This FPGA is appropriate for designers and procurement teams focused on solutions that need substantial logic capacity, embedded memory, and extensive I/O in a RoHS-compliant, surface-mount form factor.

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