XC7K325T-2FFG676I

The XC7K325T-2FFG676I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD. It delivers large on-chip logic and memory resources in a compact 676-FCBGA package for surface-mount integration.

With 326,080 logic elements and approximately 16.4 Mbits of embedded memory, this industrial-grade device is targeted at designs that require substantial programmable logic, sizable embedded RAM, and a moderate I/O count while operating across an extended temperature range.

Key Features

• Logic Capacity — 326,080 logic elements and 25,475 logic cells provide significant programmable logic resources for complex digital designs.
• Embedded Memory — Total on-chip RAM of 16,404,480 bits (approximately 16.4 Mbits) for buffering, caching, and local data storage.
• I/O Density — 400 user I/O pins to support multiple interfaces, peripherals, and parallel data channels.
• Package — 676-BBGA, FCBGA package in the supplier device package 676-FCBGA (27×27) for high-density board layouts.
• Power — Core voltage supply range of 970 mV to 1.03 V for power budgeting and system-level power design.
• Operating Range — Industrial operating temperature from −40 °C to 100 °C for deployment in extended-temperature environments.
• Mounting — Surface-mount device suitable for standard PCB assembly processes.
• Compliance — RoHS compliant.
• Grade — Industrial.

Typical Applications

• Industrial Control & Automation — Industrial-grade temperature range and robust logic/memory capacity support real-time control, protocol bridging, and machine automation tasks.
• High-density Digital Processing — Large logic element count and embedded RAM enable computationally intensive custom logic, data path processing, and FPGA-accelerated functions.
• Multi-channel I/O Systems — 400 I/O pins accommodate multi-channel sensor interfaces, parallel data aggregation, and complex I/O management.

Unique Advantages

• Substantial Logic Resources: 326,080 logic elements enable complex, large-scale programmable designs without immediate need for partitioning across multiple devices.
• Significant On‑Chip Memory: Approximately 16.4 Mbits of embedded RAM reduces reliance on external memory for buffering and local storage.
• High I/O Count: 400 I/Os allow flexible interfacing and support for multiple simultaneous channels or peripherals.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in environments requiring extended-temperature operation.
• Compact FCBGA Package: 676-FCBGA (27×27) offers a dense footprint for space-constrained PCBs while retaining high pin count.
• Regulatory Compliance: RoHS compliant for regulatory and environmental considerations.

Why Choose XC7K325T-2FFG676I?

The XC7K325T-2FFG676I positions itself as a high-capacity, industrial-grade FPGA option for applications that demand ample logic elements, significant on-chip memory, and a substantial I/O complement in a compact package. Its specified voltage range and extended operating temperature make it suitable for deployments where predictable power characteristics and environmental robustness matter.

Manufactured by AMD and offered in a 676-FCBGA package, this device fits designs requiring scalability of programmable resources and reliable operation across a broad temperature span, delivering long-term value through integration of logic, memory, and I/O in a single FPGA device.

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