XC7K325T-2FFG900C

The XC7K325T-2FFG900C is a Kintex®-7 Field Programmable Gate Array (FPGA) from AMD offering high logic capacity and on-chip memory in a 900-ball FCBGA package. Key device resources include 326,080 logic elements, approximately 16.4 Mbits of embedded memory, and 500 user I/O pins, all designed for surface-mount assembly.

Electrical and environmental parameters include a core supply voltage range of 0.970 V to 1.03 V and an operating temperature range of 0 °C to 85 °C. The device is delivered in a 900-FCBGA (31 × 31) package and is RoHS compliant.

Key Features

• Core Logic 326,080 logic elements provide substantial programmable logic capacity for complex designs and implementation flexibility.
• Embedded Memory Approximately 16.4 Mbits of on-chip RAM for data buffering, state storage, and memory-intensive logic functions.
• High I/O Count 500 I/O pins to support dense interconnect and multiple high-pin-count peripherals or board-level interfaces.
• Package & Mounting 900-ball FCBGA package (900-FCBGA, 31×31) for compact board footprint; designed for surface-mount assembly.
• Power Specified core voltage supply range from 0.970 V to 1.03 V to match system power-rail planning.
• Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance RoHS compliant for lead-free manufacturing processes.

Typical Applications

• High-density logic implementations — Use the large pool of 326,080 logic elements to implement complex FPGA-based state machines, datapaths, and custom accelerators.
• Memory-intensive functions — Approximately 16.4 Mbits of embedded RAM enables on-chip buffering, FIFO structures, and local data storage for streaming or packet-processing designs.
• Multi-interface systems — 500 user I/O pins support multiple parallel and serial interfaces, enabling integration with a variety of peripherals and daughter cards.

Unique Advantages

• High logic capacity: 326,080 logic elements enable consolidation of multiple functions into a single FPGA, reducing component count and board complexity.
• Substantial on-chip memory: Approximately 16.4 Mbits of embedded RAM supports data buffering and local algorithm state without immediate external memory dependence.
• Extensive I/O: 500 I/O pins allow flexible partitioning of signals and support for multiple interfaces or parallel buses on the same device.
• Compact, surface-mount package: 900-FCBGA (31×31) package provides a high-pin-count solution in a compact footprint for dense board designs.
• Commercial operating range: Specified 0 °C to 85 °C operating temperature and RoHS compliance simplify integration into commercial electronic products.
• Tight core voltage specification: Core supply range of 0.970 V to 1.03 V aids in precise power-supply design and thermal planning.

Why Choose XC7K325T-2FFG900C?

The XC7K325T-2FFG900C positions itself as a high-capacity Kintex®-7 FPGA option for commercial designs that require substantial programmable logic, on-chip memory, and large I/O counts in a compact FCBGA package. Its combined resource profile—326,080 logic elements, ~16.4 Mbits of RAM, and 500 I/Os—supports integration of sizable digital functions onto a single device.

This device suits engineers looking for a commercially graded FPGA with clear electrical and thermal specifications, RoHS compliance, and a high-density package format. It delivers design scalability and the on-chip resources needed for complex logic, buffering, and interfacing requirements.

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