XC7K325T-3FBG676E

The XC7K325T-3FBG676E is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD. It provides a high logic capacity device with a large embedded memory footprint and a broad complement of user I/O in a compact FCBGA package.

Designed for applications that require substantial on-chip logic, embedded memory and dense I/O, this extended-grade device balances integration and board-level space efficiency while operating within a specified core voltage and temperature range.

Key Features

• Core Logic Capacity — 326,080 logic elements for implementing large-scale programmable logic designs and complex digital functions.
• Embedded Memory — Approximately 16.4 Mbits of on-chip RAM for buffering, LUT-based storage and local data retention.
• User I/O — 400 user I/O pins to support high-density external interfacing and parallel connectivity.
• Power — Specified core supply range of 970 mV to 1.03 V to match system power-rail requirements.
• Package & Mounting — Available in a 676-FCBGA (27×27) package case (676-BBGA, FCBGA); surface-mount mounting type for compact PCB integration.
• Temperature & Grade — Extended grade device rated for operation from 0 °C to 100 °C.
• Compliance — RoHS-compliant material status.

Typical Applications

• Custom digital logic and prototyping — Large logic capacity and on-chip RAM make it suitable for development and deployment of custom FPGA-based logic functions.
• Data path and buffering — Significant embedded memory supports local buffering and temporary data storage in data-processing chains.
• High-density I/O systems — 400 user I/O enable interfacing with multiple peripherals, sensors and parallel buses on compact boards.
• Compact, board-mounted designs — Surface-mount FCBGA packaging provides a space-efficient option for densely populated PCBs.

Unique Advantages

• High logic density: 326,080 logic elements allow implementation of complex, large-scale digital designs without immediate need for external logic expansion.
• Substantial on-chip memory: Approximately 16.4 Mbits of embedded RAM reduces dependence on external memory for many buffering and local storage tasks.
• Extensive I/O count: 400 user I/O pins provide design flexibility for parallel interfaces and multi-channel connectivity.
• Compact FCBGA packaging: 676-FCBGA (27×27) format supports high integration density for space-constrained applications.
• Controlled core supply: Narrow operating voltage window (970 mV to 1.03 V) helps define power-supply requirements for predictable core operation.
• Extended-grade temperature: Rated 0 °C to 100 °C to suit systems operating within that environmental range.

Why Choose XC7K325T-3FBG676E?

The XC7K325T-3FBG676E delivers a balanced combination of high logic capacity, sizable embedded memory and robust I/O resources in a compact FCBGA package. As an AMD Kintex®-7 device, it is positioned for designs that need on-chip integration of complex digital functions while maintaining a compact board footprint and clearly defined power and thermal limits.

This device is well suited to developers and engineers building systems that require significant programmable logic and local memory, offering a straightforward specification set—logic elements, RAM bits, I/O count, package and operating ranges—that supports reliable component selection and system integration.

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