XC7K355T-2FFG901I

The XC7K355T-2FFG901I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD, offered in a high-pin-count FCBGA package. It delivers a combination of large programmable logic capacity, substantial on-chip memory, and a wide I/O complement for complex digital designs.

Engineered for designs that require high logic density and significant embedded memory while operating across an industrial temperature range, this device supports robust board-level integration with surface-mount packaging and RoHS compliance.

Key Features

• Core Logic 356,160 logic elements provide the programmable fabric for implementing complex digital functions and custom hardware accelerators.
• Embedded Memory Approximately 26.36 Mbits of on-chip RAM to support buffering, state storage, and algorithm working memory without external DRAM for many use cases.
• I/O Capacity 300 user I/O pins enable wide external connectivity and flexible interfacing to peripherals, buses, and high-pin-count systems.
• Package & Mounting Available in a 900-BBGA FCBGA package; supplier device package listed as 901-FCBGA (31×31). Surface-mount construction simplifies PCB assembly for dense boards.
• Power Core voltage supply range specified at 970 mV to 1.03 V for the FPGA core power domain.
• Temperature & Grade Industrial grade device rated for operation from -40 °C to 100 °C, suitable for environments requiring extended temperature tolerance.
• Environmental Compliance RoHS status: Compliant, meeting common lead-free requirements for electronic assemblies.

Typical Applications

• High-density digital processing — Implements large logic designs and custom datapaths using its extensive logic element count and embedded memory.
• Interface consolidation — Aggregates multiple external interfaces using 300 I/Os to simplify system I/O routing and reduce board-level complexity.
• Industrial control and instrumentation — Supports designs that require industrial temperature operation and robust surface-mount packaging.

Unique Advantages

• Substantial programmable capacity: 356,160 logic elements allow complex designs and partitioning of multiple functions on a single device.
• Significant on-chip RAM: Approximately 26.36 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
• High I/O count: 300 user I/Os enable broad external connectivity, minimizing the need for additional interface chips.
• Industrial temperature rating: Specified operation from -40 °C to 100 °C supports applications with extended temperature requirements.
• Compact surface-mount package: FCBGA format and 31×31 supplier package footprint aid in high-density PCB designs and automated assembly.
• RoHS compliant: Facilitates compliance with lead-free manufacturing processes.

Why Choose XC7K355T-2FFG901I?

The XC7K355T-2FFG901I positions itself as a high-capacity Kintex®-7 FPGA option for designs that require large programmable logic, substantial embedded memory, and extensive I/O connectivity within a surface-mount FCBGA footprint. Its industrial temperature rating and RoHS compliance make it suitable for systems where environmental tolerance and lead-free assembly are important.

Designers seeking a scalable, integrated FPGA solution for complex digital processing, interface consolidation, or industrial applications can leverage the device’s logic density, on-chip RAM, and 300 I/O pins to reduce board-level complexity and consolidate functions onto a single programmable device.

Request a quote or submit a pricing and availability inquiry to receive lead-time and purchasing details for the XC7K355T-2FFG901I.