XC7K410T-1FBG676C

The XC7K410T-1FBG676C is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD delivering high-capacity programmable logic in a compact FCBGA package. It provides substantial on-chip resources—approximately 406,720 logic elements and about 29.3 Mbits of embedded memory—along with up to 400 user I/Os, making it suited for designs that require dense logic, significant embedded RAM, and a high I/O count.

Designed for surface-mount assembly, this commercial-grade device operates from a core supply range of 0.97 V to 1.03 V and across a 0 °C to 85 °C operating temperature range. The part is RoHS compliant and supplied in a 676-FCBGA (27 × 27 mm) package.

Key Features

• Logic Capacity  Approximately 406,720 logic elements available for implementing complex logic, state machines, and custom datapaths.
• Embedded Memory  Approximately 29.3 Mbits of on-chip RAM to support buffering, lookup tables, and on-chip data storage.
• I/O  Up to 400 user I/Os to interface with peripherals, sensors, and external memory or logic devices.
• Power and Core Supply  Core voltage range specified at 0.97 V to 1.03 V for the FPGA fabric.
• Package and Mounting  676-FCBGA package (27 × 27 mm) designed for surface-mount assembly, offering a compact footprint for high-density board layouts.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS compliant for environmentally responsible assembly.

Unique Advantages

• High logic density: Supports designs requiring large numbers of instantiated logic functions with approximately 406,720 logic elements.
• Substantial embedded memory: Around 29.3 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
• Generous I/O capability: 400 I/Os enable broad connectivity to sensors, interfaces, and peripherals without immediate need for external I/O expanders.
• Compact package: 676-FCBGA (27 × 27 mm) provides high integration density for space-constrained PCB designs.
• Commercial operating range: Rated 0 °C to 85 °C to meet typical commercial application environments.
• Regulatory alignment: RoHS compliance supports lead-free assembly and regulatory requirements for many markets.

Why Choose XC7K410T-1FBG676C?

The XC7K410T-1FBG676C positions itself as a high-capacity Kintex®-7 FPGA option that combines a large logic element count and significant embedded memory with a high I/O complement in a compact FCBGA package. It is well suited to designers and engineers who need dense programmable logic, meaningful on-chip RAM, and extensive I/O capability within a commercial temperature range.

With AMD manufacturing and the Kintex-7 family identification, this device offers a clear specification set for procurement and system integration where high logic density and embedded memory are primary requirements. Its package and RoHS compliance support modern assembly practices and space-optimized board designs.

Request a quote or submit an inquiry to obtain pricing and availability for the XC7K410T-1FBG676C and to discuss how it fits your design requirements.