XC7K410T-1FBG900I

IC FPGA 500 I/O 900FCBGA
Part Description

Kintex®-7 Field Programmable Gate Array (FPGA) IC 500 29306880 406720 900-BBGA, FCBGA

Quantity 533 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package900-FCBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case900-BBGA, FCBGANumber of I/O500Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs31775Number of Logic Elements/Cells406720
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits29306880

Overview of XC7K410T-1FBG900I – Kintex®-7 FPGA 900-FCBGA (31×31)

The XC7K410T-1FBG900I is a Kintex®-7 field programmable gate array (FPGA) from AMD designed for industrial-grade embedded applications. It delivers a large logic capacity and substantial on-chip memory in a high-density 900-FCBGA (31×31) surface-mount package, supporting designs that require significant programmable logic, memory resources, and large I/O counts.

Key Features

  • Kintex®-7 FPGA core  Industry-recognized Kintex®-7 FPGA architecture in the XC7K410T family.
  • Logic capacity  Approximately 406,720 logic elements to implement complex digital functions.
  • Embedded memory  Approximately 29.3 Mbits of on-chip RAM for buffering, caching, and data storage.
  • I/O resources  500 user I/O pins to support wide peripheral and interface integration.
  • Power supply  Core supply range from 0.970 V to 1.03 V for the FPGA core domain.
  • Package and mounting  900-FCBGA (31×31) / 900-BBGA package, surface-mount mounting for high-density board designs.
  • Operating range and grade  Industrial-grade device rated for operation from -40 °C to 100 °C.
  • Regulatory compliance  RoHS compliant.

Unique Advantages

  • High programmable density: Approximately 406,720 logic elements provide the capacity needed for large-scale FPGA implementations.
  • Substantial on-chip memory: Approximately 29.3 Mbits of embedded RAM reduces dependence on external memory for many designs.
  • Extensive I/O: 500 I/Os enable connectivity to multiple peripherals, sensors, and high-speed interfaces.
  • Industrial temperature rating: Operation from -40 °C to 100 °C supports deployments in demanding environments.
  • Compact, high-density packaging: 900-FCBGA (31×31) surface-mount package allows for compact board integration while preserving capability.
  • RoHS compliant: Meets environmental compliance requirements for lead-free assembly.

Why Choose XC7K410T-1FBG900I?

The XC7K410T-1FBG900I is positioned for designs that demand a high count of logic elements, significant embedded memory, and large I/O capacity within an industrial temperature envelope. Its 900-FCBGA (31×31) surface-mount package and core supply range of 0.970 V to 1.03 V make it a clear option for engineers specifying a high-density Kintex®-7 FPGA for robust embedded applications.

Engineers and procurement teams seeking a RoHS-compliant, industrial-grade FPGA with roughly 406,720 logic elements, approximately 29.3 Mbits of on-chip RAM, and 500 I/Os will find the XC7K410T-1FBG900I tailored to demanding, high-capacity programmable designs.

Request a quote or submit a purchase inquiry for XC7K410T-1FBG900I to begin sourcing this Kintex®-7 FPGA for your next design.

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