XC7K410T-1FBG900I
| Part Description |
Kintex®-7 Field Programmable Gate Array (FPGA) IC 500 29306880 406720 900-BBGA, FCBGA |
|---|---|
| Quantity | 533 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 900-FCBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 900-BBGA, FCBGA | Number of I/O | 500 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 31775 | Number of Logic Elements/Cells | 406720 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 29306880 |
Overview of XC7K410T-1FBG900I – Kintex®-7 FPGA 900-FCBGA (31×31)
The XC7K410T-1FBG900I is a Kintex®-7 field programmable gate array (FPGA) from AMD designed for industrial-grade embedded applications. It delivers a large logic capacity and substantial on-chip memory in a high-density 900-FCBGA (31×31) surface-mount package, supporting designs that require significant programmable logic, memory resources, and large I/O counts.
Key Features
- Kintex®-7 FPGA core Industry-recognized Kintex®-7 FPGA architecture in the XC7K410T family.
- Logic capacity Approximately 406,720 logic elements to implement complex digital functions.
- Embedded memory Approximately 29.3 Mbits of on-chip RAM for buffering, caching, and data storage.
- I/O resources 500 user I/O pins to support wide peripheral and interface integration.
- Power supply Core supply range from 0.970 V to 1.03 V for the FPGA core domain.
- Package and mounting 900-FCBGA (31×31) / 900-BBGA package, surface-mount mounting for high-density board designs.
- Operating range and grade Industrial-grade device rated for operation from -40 °C to 100 °C.
- Regulatory compliance RoHS compliant.
Unique Advantages
- High programmable density: Approximately 406,720 logic elements provide the capacity needed for large-scale FPGA implementations.
- Substantial on-chip memory: Approximately 29.3 Mbits of embedded RAM reduces dependence on external memory for many designs.
- Extensive I/O: 500 I/Os enable connectivity to multiple peripherals, sensors, and high-speed interfaces.
- Industrial temperature rating: Operation from -40 °C to 100 °C supports deployments in demanding environments.
- Compact, high-density packaging: 900-FCBGA (31×31) surface-mount package allows for compact board integration while preserving capability.
- RoHS compliant: Meets environmental compliance requirements for lead-free assembly.
Why Choose XC7K410T-1FBG900I?
The XC7K410T-1FBG900I is positioned for designs that demand a high count of logic elements, significant embedded memory, and large I/O capacity within an industrial temperature envelope. Its 900-FCBGA (31×31) surface-mount package and core supply range of 0.970 V to 1.03 V make it a clear option for engineers specifying a high-density Kintex®-7 FPGA for robust embedded applications.
Engineers and procurement teams seeking a RoHS-compliant, industrial-grade FPGA with roughly 406,720 logic elements, approximately 29.3 Mbits of on-chip RAM, and 500 I/Os will find the XC7K410T-1FBG900I tailored to demanding, high-capacity programmable designs.
Request a quote or submit a purchase inquiry for XC7K410T-1FBG900I to begin sourcing this Kintex®-7 FPGA for your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








