XC7K410T-1FFG676I

The XC7K410T-1FFG676I is a Kintex®-7 Field Programmable Gate Array (FPGA) packaged in a 676-ball FCBGA (27×27) surface-mount package. It provides a high-density programmable fabric with 31,775 CLBs and 406,720 logic elements, plus approximately 29.3 Mbits of embedded memory, making it suitable for designs that require substantial on-chip logic and RAM resources. Voltage and thermal operating ranges are specified to support industrial applications.

Key Features

• Configurable Logic and Capacity 31,775 CLBs and 406,720 logic elements provide large programmable logic capacity for complex digital designs.
• Embedded Memory Approximately 29.3 Mbits of on-chip RAM to support buffering, state machines, and data-path storage without external RAM dependency.
• I/O Count 400 user I/O pins to enable broad connectivity to peripherals, interfaces, and daughter cards.
• Power Supply Range Core voltage specified from 0.970 V to 1.03 V to match system power designs and ensure correct core operation.
• Package and Mounting 676-BBGA / 676-FCBGA (27×27) surface-mount package for compact board-level integration and high pin density.
• Operating Temperature Specified industrial temperature range from −40 °C to 100 °C for operation in a wide set of environments.
• Compliance RoHS compliant.

Unique Advantages

• High logical density: The combination of 31,775 CLBs and 406,720 logic elements enables complex digital implementations with fewer external ASICs or discrete logic devices.
• Significant on-chip RAM: Approximately 29.3 Mbits of embedded memory reduces dependence on external memory for many buffering and data-path tasks, simplifying board design.
• Broad I/O capability: 400 I/O pins provide the flexibility to connect multiple peripherals, sensors, and interfaces directly to the FPGA fabric.
• Industrial temperature support: Operation from −40 °C to 100 °C supports deployments in harsher environments where temperature resilience is required.
• High-density package: The 676-FCBGA (27×27) package offers a compact footprint with high pin count for space-constrained, high-performance boards.
• Regulatory friendliness: RoHS compliance helps meet environmental and procurement requirements.

Why Choose XC7K410T-1FFG676I?

The XC7K410T-1FFG676I positions itself as a high-capacity Kintex-7 FPGA option that balances extensive logic and embedded memory resources with a dense 676-ball FCBGA package. Its combination of 406,720 logic elements, approximately 29.3 Mbits of on-chip RAM, and 400 I/O pins makes it well suited for designers needing large, integrated programmable fabric in an industrial-grade device.

Engineers and procurement teams looking for scalable FPGA resources, compact board-level integration, and specified industrial operating ranges will find this device appropriate for complex digital signal processing, control logic, and system-level integration where on-chip capacity and robust temperature support matter.

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