XC7K410T-1FFV900I

The XC7K410T-1FFV900I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC designed to deliver high digital integration in a single surface-mount package. It combines a large configurable logic fabric with abundant on-chip memory and a broad I/O count to address complex interface and compute tasks.

With 406,720 logic elements, approximately 29.3 Mbits of embedded memory, and support for 500 I/O, this industrial-grade device is intended for demanding designs that require significant programmable logic capacity, extensive I/O connectivity, and reliable operation across a -40 °C to 100 °C operating range.

Key Features

• Logic Capacity — 406,720 logic elements provide a large programmable fabric for implementing complex digital functions and custom accelerators.
• Embedded Memory — Approximately 29.3 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive logic without relying solely on external memory.
• I/O Density — 500 user I/O pins to accommodate multi-channel interfaces, parallel buses, and mixed signal I/O requirements.
• Power Supply — Core voltage range specified from 970 mV to 1.03 V to match system power-rail design requirements.
• Package — 900-ball BGA FCBGA package (900-FCBGA, 31 × 31) for high-density board integration in surface-mount applications.
• Industrial Temperature Range — Rated for operation from -40 °C to 100 °C to meet extended-environment deployment needs.
• Regulatory Compliance — RoHS compliant for environmentally conscious designs and supply-chain compliance.

Typical Applications

• Custom Digital Systems — Implement complex, application-specific logic using the device’s 406,720 logic elements and embedded memory for on-chip data processing.
• High-Density I/O Interfaces — Support multi-protocol or multi-channel front ends with 500 available I/O pins for broad connectivity options.
• Embedded Data Handling — Use the approximately 29.3 Mbits of on-chip RAM for buffering, packet processing, and real-time data paths.

Unique Advantages

• High Integration Density: Large logic element count and substantial embedded RAM reduce the need for external glue logic and memory, simplifying board design.
• Extensive I/O: 500 I/O pins enable rich interfacing options for multi-channel systems, sensors, and external peripherals.
• Industrial Reliability: Specified for -40 °C to 100 °C operation to support extended-temperature deployments and harsher operating environments.
• Compact Packaging: 900-FCBGA (31 × 31) package balances high pin-count requirements with surface-mount assembly for compact system layouts.
• Regulatory Compliance: RoHS compliance supports environmentally regulated product designs and supply-chain requirements.

Why Choose XC7K410T-1FFV900I?

The XC7K410T-1FFV900I positions itself as a high-capacity, industrial-grade FPGA suitable for designs that demand large programmable logic resources, significant on-chip RAM, and expansive I/O in a compact package. Its electrical and thermal specifications make it appropriate for system-level designs where integration density and reliable operation across a wide temperature range are required.

Manufactured by AMD, this Kintex®-7 device offers a balance of logic density, embedded memory, and I/O capability that supports scalable implementations—from complex digital signal paths to multi-interface control systems—while meeting common environmental and compliance expectations.

If you would like pricing, availability, or to request a quote for the XC7K410T-1FFV900I, submit an inquiry or request a quote to begin the procurement process.