XC7K410T-2FBG676I

The XC7K410T-2FBG676I is a Kintex‑7 field‑programmable gate array (FPGA) offering large logic capacity and on‑chip memory in a 676‑ball FCBGA package. It is targeted at applications that require substantial programmable logic, abundant I/O, and industrial‑grade operating conditions.

With 406,720 logic elements, approximately 29.3 Mbits of embedded memory and up to 400 I/O, this device delivers a balance of integration and scalability for demanding embedded and industrial designs while operating over a wide temperature and supply range.

Key Features

• Logic Capacity — 406,720 logic elements to implement large digital designs and complex state machines.
• Embedded Memory — Approximately 29.3 Mbits of on‑chip RAM for buffering, local data storage, and intermediate processing.
• I/O Resources — Up to 400 I/O pins to support dense external connectivity and multiple peripheral interfaces.
• Package — 676‑ball FCBGA (27×27) surface‑mount package for high‑density board integration.
• Power — Core voltage range from 970 mV to 1.03 V for system power planning and supply design.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation to meet industrial environment requirements.
• Mounting & Compliance — Surface mount package and RoHS‑compliant construction for standard manufacturing and environmental compliance.

Typical Applications

• Industrial Automation — Implement control logic, sensor interfacing, and deterministic I/O handling using extensive logic and I/O resources at industrial temperatures.
• Embedded Signal Processing — Use the large logic fabric and on‑chip RAM for custom data path processing and buffering in embedded systems.
• Communications and Networking — Deploy protocol handling, packet processing, and interface aggregation where many I/O and programmable logic are required.
• High‑density I/O Systems — Integrate multiple peripheral interfaces and large pin counts for board‑level consolidation and system integration.

Unique Advantages

• Substantial Logic Density: 406,720 logic elements enable implementation of large-scale digital functions without external logic expansion.
• Significant Embedded Memory: Approximately 29.3 Mbits of on‑chip RAM reduces the need for external memory for many buffering and processing tasks.
• High I/O Count: Up to 400 I/O pins support complex interfacing requirements and reduce the need for additional I/O expanders.
• Industrial‑grade Operation: −40 °C to 100 °C rating and surface‑mount FCBGA packaging make the device suitable for industrial environments and compact board layouts.
• Predictable Power Window: Defined core supply range (970 mV–1.03 V) simplifies power budgeting and regulator selection.
• RoHS Compliant: Meets environmental compliance expectations for contemporary electronic manufacturing.

Why Choose XC7K410T-2FBG676I?

The XC7K410T-2FBG676I positions itself as a high‑capacity Kintex‑7 FPGA option for designs that require a large amount of programmable logic, generous on‑chip memory, and extensive I/O in an industrial‑rated package. Its combination of logic elements, embedded RAM and 400 I/O points makes it suitable for systems that need integration and scalability without relying on multiple discrete devices.

Engineers building industrial controls, embedded processing platforms, communications equipment, or any application needing dense logic and reliable operation across −40 °C to 100 °C will find this device a practical choice for simplifying board design and meeting long‑term deployment requirements.

Request a quote or submit a purchase inquiry to check pricing and availability for the XC7K410T-2FBG676I.