XC7K410T-1FFG900I

IC FPGA 500 I/O 900FCBGA
Part Description

Kintex®-7 Field Programmable Gate Array (FPGA) IC 500 29306880 406720 900-BBGA, FCBGA

Quantity 318 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package900-FCBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case900-BBGA, FCBGANumber of I/O500Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs31775Number of Logic Elements/Cells406720
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits29306880

Overview of XC7K410T-1FFG900I – Kintex®-7 FPGA, 406,720 logic elements, 500 I/O

The XC7K410T-1FFG900I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC delivering high logic density and significant on-chip memory for complex digital designs. It features 406,720 logic elements, approximately 29.3 Mbits of embedded memory and 500 user I/O to support dense, multi‑interface implementations.

Packaged in a 900-FCBGA (31×31) surface-mount form factor with an industrial operating range (‑40 °C to 100 °C) and a core supply range of 0.970 V to 1.03 V, this device is specified for systems that require integrated logic capacity, memory and I/O in a compact industrial-grade package.

Key Features

  • Core / Logic: 406,720 logic elements provide substantial programmable logic capacity for large-scale digital functions.
  • Embedded Memory: Approximately 29.3 Mbits of on-chip RAM to support buffering, packet processing, and other memory‑intensive tasks.
  • I/O Integration: 500 user I/O pins enable wide connectivity for multiple interfaces, peripherals and parallel buses.
  • Power: Core voltage supply specified from 0.970 V to 1.03 V to match system power rails and board-level power design.
  • Package & Mounting: 900-FCBGA (31×31) package in a 900-BBGA FCBGA footprint, surface-mount mounting type for compact board integration.
  • Temperature & Grade: Industrial grade device with an operating temperature range of -40 °C to 100 °C for extended environmental use.
  • Environmental Compliance: RoHS compliant.

Unique Advantages

  • High logic density: 406,720 logic elements enable consolidation of complex functions into a single device, reducing board count.
  • Substantial on-chip memory: Approximately 29.3 Mbits of embedded RAM supports data buffering and local storage without external memory.
  • Large I/O complement: 500 I/O pins simplify multi-interface designs and reduce the need for I/O expanders.
  • Industrial operating range: Rated for -40 °C to 100 °C operation and marked industrial grade for deployment in harsh environments.
  • Compact, manufacturable package: 900-FCBGA (31×31) surface-mount package balances board area and routing density for high-performance systems.
  • Regulatory compliance: RoHS compliant to support environmentally conscious product development.

Why Choose XC7K410T-1FFG900I?

The XC7K410T-1FFG900I offers a balanced combination of dense programmable logic, embedded memory and extensive I/O in an industrial-grade, surface-mount FCBGA package. Its specification set—high logic capacity, sizable on-chip RAM and a 500-pin I/O complement—makes it well suited to designs that require integration of multiple high-speed interfaces and significant on-chip processing.

For design teams targeting robust, compact implementations that must operate across an extended temperature range, this Kintex®-7 FPGA provides verifiable hardware capability and packaging choices that simplify system integration and deployment.

Request a quote or submit an inquiry for pricing and availability of the XC7K410T-1FFG900I to receive further procurement details and lead-time information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up