XC7K410T-1FFG900I
| Part Description |
Kintex®-7 Field Programmable Gate Array (FPGA) IC 500 29306880 406720 900-BBGA, FCBGA |
|---|---|
| Quantity | 318 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 900-FCBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 900-BBGA, FCBGA | Number of I/O | 500 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 31775 | Number of Logic Elements/Cells | 406720 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 29306880 |
Overview of XC7K410T-1FFG900I – Kintex®-7 FPGA, 406,720 logic elements, 500 I/O
The XC7K410T-1FFG900I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC delivering high logic density and significant on-chip memory for complex digital designs. It features 406,720 logic elements, approximately 29.3 Mbits of embedded memory and 500 user I/O to support dense, multi‑interface implementations.
Packaged in a 900-FCBGA (31×31) surface-mount form factor with an industrial operating range (‑40 °C to 100 °C) and a core supply range of 0.970 V to 1.03 V, this device is specified for systems that require integrated logic capacity, memory and I/O in a compact industrial-grade package.
Key Features
- Core / Logic: 406,720 logic elements provide substantial programmable logic capacity for large-scale digital functions.
- Embedded Memory: Approximately 29.3 Mbits of on-chip RAM to support buffering, packet processing, and other memory‑intensive tasks.
- I/O Integration: 500 user I/O pins enable wide connectivity for multiple interfaces, peripherals and parallel buses.
- Power: Core voltage supply specified from 0.970 V to 1.03 V to match system power rails and board-level power design.
- Package & Mounting: 900-FCBGA (31×31) package in a 900-BBGA FCBGA footprint, surface-mount mounting type for compact board integration.
- Temperature & Grade: Industrial grade device with an operating temperature range of -40 °C to 100 °C for extended environmental use.
- Environmental Compliance: RoHS compliant.
Unique Advantages
- High logic density: 406,720 logic elements enable consolidation of complex functions into a single device, reducing board count.
- Substantial on-chip memory: Approximately 29.3 Mbits of embedded RAM supports data buffering and local storage without external memory.
- Large I/O complement: 500 I/O pins simplify multi-interface designs and reduce the need for I/O expanders.
- Industrial operating range: Rated for -40 °C to 100 °C operation and marked industrial grade for deployment in harsh environments.
- Compact, manufacturable package: 900-FCBGA (31×31) surface-mount package balances board area and routing density for high-performance systems.
- Regulatory compliance: RoHS compliant to support environmentally conscious product development.
Why Choose XC7K410T-1FFG900I?
The XC7K410T-1FFG900I offers a balanced combination of dense programmable logic, embedded memory and extensive I/O in an industrial-grade, surface-mount FCBGA package. Its specification set—high logic capacity, sizable on-chip RAM and a 500-pin I/O complement—makes it well suited to designs that require integration of multiple high-speed interfaces and significant on-chip processing.
For design teams targeting robust, compact implementations that must operate across an extended temperature range, this Kintex®-7 FPGA provides verifiable hardware capability and packaging choices that simplify system integration and deployment.
Request a quote or submit an inquiry for pricing and availability of the XC7K410T-1FFG900I to receive further procurement details and lead-time information.

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