XC7K410T-2FB900I

The XC7K410T-2FB900I is a Kintex‑7 field programmable gate array (FPGA) IC from AMD, offered in a 900‑ball FCBGA package. It provides a high logic element count alongside substantial on‑chip memory and a large I/O complement for complex, reconfigurable digital designs.

Built to industrial temperature requirements and RoHS compliant, this device is suited to applications that require a combination of dense logic resources, embedded RAM, and broad I/O connectivity within a compact surface‑mount package.

Key Features

• Core Logic  406,720 logic elements for implementing large-scale digital designs and custom hardware functions.
• Embedded Memory  Approximately 29.3 Mbits of on‑chip RAM to support buffering, FIFOs, and intermediate data storage.
• I/O Capacity  350 device I/Os to enable wide parallel connectivity and multiple interface endpoints.
• Power Supply  Operates with a core voltage range of 970 mV to 1.03 V, enabling precise power budgeting in system designs.
• Package & Mounting  900‑FCBGA (31×31) / 900‑BBGA package designed for surface‑mount PCB assembly to save board area.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• High‑density digital processing  Implement large custom logic blocks and data paths using the device's extensive logic element count and embedded RAM.
• Interface aggregation  Consolidate multiple parallel and serial interfaces leveraging 350 I/Os for flexible system I/O mapping.
• Embedded system acceleration  Offload compute‑intensive tasks to FPGA fabric where on‑chip memory supports buffering and fast local storage.

Unique Advantages

• High logic density: 406,720 logic elements enable implementation of complex, large‑scale FPGA designs without external logic expansion.
• Substantial on‑chip RAM: Approximately 29.3 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
• Broad I/O count: 350 I/Os provide flexibility to connect numerous peripherals, sensors, or high‑speed interfaces directly to the device.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature‑challenging environments.
• Compact FCBGA footprint: 900‑FCBGA (31×31) packaging balances high integration with a surface‑mount form factor for space‑constrained PCBs.
• Regulatory readiness: RoHS compliance simplifies integration into products targeting regulatory and environmental standards.

Why Choose XC7K410T-2FB900I?

The XC7K410T-2FB900I combines a high count of logic elements with substantial embedded RAM and a large I/O complement in a compact 900‑ball FCBGA package. Its industrial temperature rating and RoHS compliance make it a reliable choice for applications that need dense, reconfigurable logic and significant local memory in a surface‑mount form factor.

This part is appropriate for design teams building complex FPGA‑based systems that require on‑chip resources for logic, buffering, and extensive I/O, while maintaining compliance and temperature robustness for industrial deployment.

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