XC7K410T-2FBG676C

The XC7K410T-2FBG676C is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD, offering a high density of programmable logic and on-chip memory. Key device metrics include 406,720 logic cells, approximately 29.3 Mbits of on-chip RAM, and 400 user I/O pins.

This commercial-grade, surface-mount FCBGA device is specified for a core voltage range of 0.970–1.03 V and an operating temperature range of 0 °C to 85 °C, delivered in a 676-FCBGA (27×27) package suitable for compact, high-pin-count board designs.

Key Features

• Core Logic  406,720 logic cells provide extensive programmable logic resources for complex digital designs.
• On-Chip Memory  Approximately 29.3 Mbits of total RAM bits for buffering, state storage, and memory-intensive logic functions.
• I/O Capacity  400 I/O pins support dense external connectivity and interface options on high-channel designs.
• Power Supply  Specified core voltage range from 0.970 V to 1.03 V for the device core.
• Package & Mounting  676-FCBGA (27×27) package in a surface-mount format for high I/O density in compact layouts.
• Temperature & Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS-compliant construction.

Unique Advantages

• High-density programmable fabric: 406,720 logic cells enable large-scale logic integration without immediate external FPGA expansion.
• Substantial embedded memory: Approximately 29.3 Mbits of on-chip RAM reduces dependence on external memory for latency-sensitive buffering and data paths.
• Generous I/O count: 400 user I/Os support multiple parallel interfaces and high-channel systems on a single device.
• Compact, high-pin-count package: 676-FCBGA (27×27) provides a balance of pin density and board-level footprint for space-constrained designs.
• Commercial-grade thermal range: Specified 0 °C to 85 °C operation for standard commercial applications.
• RoHS compliant: Meets common environmental requirements for electronic assemblies.

Why Choose XC7K410T-2FBG676C?

The XC7K410T-2FBG676C delivers a combination of high logic capacity, ample embedded RAM, and extensive I/O in a single Kintex-7 FPGA package from AMD. Its specifications make it suitable for commercial designs that require significant on-chip resources and a compact, surface-mount FCBGA footprint.

For designers seeking a commercially graded, high-density FPGA with defined core voltage and operating-temperature limits, this part offers clear, verifiable device-level attributes that support scalable and integrated digital designs within the Kintex-7 family.

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