XC7K410T-2FBV676I

The XC7K410T-2FBV676I is a Kintex®-7 Field Programmable Gate Array (FPGA) manufactured by AMD. It delivers high logic density and on-chip memory capacity in a 676-FCBGA (27×27) surface-mount package intended for industrial-grade designs.

With approximately 406,720 logic elements and roughly 29.3 Mbits of embedded memory, this device is targeted at programmable-logic designs that require large logic capacity, substantial embedded RAM, and a broad I/O count within an industrial temperature range.

Key Features

• Logic Capacity — Approximately 406,720 logic elements to support high-density programmable logic implementations.
• Embedded Memory — Approximately 29.3 Mbits of on-chip RAM for buffering, frame storage, and intermediate data processing.
• I/O — 400 user I/O pins to support wide external connectivity and interface aggregation.
• Power Supply Range — Core voltage supply range of 0.970 V to 1.03 V to match system power design requirements.
• Package and Mounting — 676-ball FCBGA (27×27) package, surface-mount, for compact board-level integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for use in demanding environments.
• Compliance — RoHS compliant material status for regulatory and environmental requirements.

Typical Applications

• Custom digital logic and prototyping — Implement complex, high-density logic functions and hardware prototypes using abundant logic elements and on-chip RAM.
• High-density I/O systems — Aggregate and manage numerous external interfaces with the device's 400 I/O pins.
• Embedded memory buffering — Use the approximately 29.3 Mbits of embedded RAM for packet buffering, temporary storage, or intermediate data handling.
• Industrial control and automation — Deploy in systems that require industrial temperature operation and durable surface-mount packaging.

Unique Advantages

• High logic integration: Approximately 406,720 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level component count.
• Substantial embedded memory: Roughly 29.3 Mbits of on-chip RAM supports data buffering and memory-intensive algorithms without external RAM.
• Extensive I/O: 400 I/O pins provide flexibility for interfacing to multiple peripherals and high-pin-count systems.
• Industrial operating range: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact FCBGA package: 676-ball, 27×27 FCBGA enables a high-density footprint suitable for constrained PCB designs.
• Regulatory compliance: RoHS-compliant construction supports environmental and materials requirements.

Why Choose XC7K410T-2FBV676I?

The XC7K410T-2FBV676I positions itself as a high-capacity Kintex-7 FPGA option from AMD, combining hundreds of thousands of logic elements with tens of megabits of embedded RAM and a large I/O complement. Its industrial temperature rating and compact 676-FCBGA package make it suitable for robust designs that need substantial programmable logic and memory on a single device.

This FPGA is well suited for engineers and teams building complex programmable-logic systems that require high integration density, significant on-chip memory, and a broad set of I/O options while operating across an industrial temperature range.

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