XC7K410T-2FF676I

The XC7K410T-2FF676I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD. It provides high logic density with 406,720 logic elements, approximately 29.3 Mbits of embedded memory, and 400 user I/O pins in a 676-ball FCBGA supplier device package (27x27).

Manufactured for industrial applications, the device supports surface-mount assembly and operates over a broad supply and temperature range, offering a combination of capacity, I/O count, and environmental robustness for demanding designs.

Key Features

• Logic Capacity — 406,720 logic elements and 31,775 configurable logic blocks (CLBs) provide substantial programmable fabric for complex logic and custom architectures.
• Embedded Memory — Approximately 29.3 Mbits of on-chip RAM to support buffering, packet storage, and state retention without external memory for many functions.
• I/O Density — 400 user I/O pins to interface with high-pin-count peripherals, buses, and I/O subsystems.
• Package — 676-BBGA / 676-FCBGA supplier device package (27x27) optimized for high-density board integration and surface-mount assembly.
• Power — Core voltage supply range of 0.970 V to 1.03 V to match system power rails and enable controlled core-power design.
• Environmental Range — Industrial grade with operating temperature from −40°C to 100°C for deployment in thermally demanding environments.
• Mounting & Compliance — Surface mount package with RoHS compliance for modern assembly and environmental requirements.

Unique Advantages

• High logic density: 406,720 logic elements enable implementation of large-scale custom logic, parallel processing, and complex state machines on a single device.
• Substantial embedded memory: Approximately 29.3 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O capability: 400 I/O pins support multiple high-pin-count interfaces and complex board-level integration.
• Industrial temperature qualification: Rated from −40°C to 100°C to support deployment in a wide range of industrial environments.
• Compact FCBGA footprint: 676-ball FCBGA (27x27) package delivers high integration density while remaining compatible with surface-mount PCB processes.
• Controlled core voltage: Narrow supply range (0.970 V to 1.03 V) facilitates predictable power design and regulation strategies.

Why Choose XC7K410T-2FF676I?

The XC7K410T-2FF676I combines high logic capacity, significant embedded memory, and a large I/O complement in an industrial-grade Kintex®-7 FPGA package. These attributes make it suitable for designs that require substantial programmable logic resources, on-chip storage, and robust environmental performance.

With RoHS compliance, surface-mount packaging, and a controlled core voltage range, the device offers a balanced platform for engineering teams and procurement seeking a high-density FPGA solution backed by AMD's Kintex®-7 architecture.

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