XC7K410T-2FFG676I

The XC7K410T-2FFG676I is a Kintex®-7 field programmable gate array (FPGA) IC offering high logic capacity and substantial on-chip memory in a 676-ball FCBGA package. Designed for industrial-grade applications, it provides a combination of programmable logic, large embedded RAM, and a high I/O count for dense, performance-oriented designs.

Key architectural highlights include roughly 406,720 logic elements, approximately 29.3 Mbits of embedded memory, and 400 I/O pins, delivering design flexibility for systems that require significant programmable resources and configurable I/O.

Key Features

• Logic Capacity  Approximately 406,720 logic elements supported by about 31,775 configurable logic blocks (CLBs), enabling complex digital designs and high-density logic implementation.
• Embedded Memory  Approximately 29.3 Mbits of on-chip RAM, suitable for buffering, FIFO, and local storage requirements within the FPGA fabric.
• I/O Density  400 general-purpose I/O pins to support broad interfacing needs across peripherals, sensors, and external devices.
• Package & Mounting  676-ball FCBGA package (676-FCBGA, 27×27) with surface-mount mounting for compact board-level integration.
• Power  Core voltage range of 970 mV to 1.03 V, enabling defined power planning for the FPGA core.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C and specified as industrial grade for temperature resilience in demanding environments.
• RoHS Compliant  Manufactured to meet RoHS environmental standards.

Typical Applications

• High-density I/O systems  Use the 400 I/O pins to interface with multiple sensors, peripherals, and external memory in systems that require broad connectivity.
• Embedded acceleration  Leverage the large logic element count and embedded RAM for hardware acceleration and custom processing blocks in compute-focused designs.
• Industrial control  Industrial-temperature rating and robust package options make this FPGA suitable for control systems and automation equipment that require reliable operation across a wide temperature range.
• Data buffering and signal processing  Significant on-chip RAM supports buffering, streaming, and other memory-intensive signal processing tasks.

Unique Advantages

• High logic density: The combination of roughly 406,720 logic elements and ~31,775 CLBs allows implementation of complex, large-scale designs within a single device.
• Substantial on-chip memory: Approximately 29.3 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Broad interfacing capability: 400 I/O pins provide flexibility to connect multiple peripherals and external devices without additional I/O expansion.
• Industrial robustness: Rated for -40 °C to 100 °C operation and specified as industrial grade for use in demanding environments.
• Compact board-level integration: 676-FCBGA (27×27) surface-mount package balances high pin count with a compact footprint for space-constrained designs.
• Regulatory compliance: RoHS-compliant manufacturing supports environmentally conscious design requirements.

Why Choose XC7K410T-2FFG676I?

The XC7K410T-2FFG676I positions itself as a versatile, industrial-grade Kintex®-7 FPGA option when designers need a high mix of logic, memory, and I/O in a compact package. Its balance of approximately 406,720 logic elements, ~29.3 Mbits of embedded memory, and 400 I/O pins makes it suitable for complex embedded acceleration, high-density interfacing, and industrial control applications.

For teams focused on scalability and reliable long-term deployments, this device provides a clear hardware platform with defined voltage and temperature characteristics, minimizing surprises during system integration and environmental testing.

Request a quote or submit a purchase inquiry to receive pricing and availability for the XC7K410T-2FFG676I and to discuss quantity, lead time, and delivery options.