XC7K410T-2FFG900I

The XC7K410T-2FFG900I is a Kintex®-7 field programmable gate array (FPGA) offered in a 900-ball FCBGA package. It provides a high logic-density fabric with a large pool of embedded memory and a broad I/O complement, packaged for surface-mount assembly.

This device targets industrial-grade applications requiring a large number of logic elements, substantial on-chip RAM, and configurable I/O. Key electrical and environmental parameters include a core supply range of 970 mV to 1.03 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity  Contains 406,720 logic elements to implement complex programmable logic and custom hardware functions.
• Configurable Logic Blocks  Reported 31,775 CLBs to structure logic resources for partitioned and hierarchical designs.
• Embedded Memory  Approximately 29.3 Mbits of on-chip RAM for buffering, state storage, and local memory needs within designs.
• High I/O Count  Up to 500 I/O pins to support multiple parallel interfaces and mixed-signal board-level connectivity strategies.
• Power  Core supply voltage specified between 970 mV and 1.03 V for the device core domain.
• Package and Mounting  900-ball FCBGA package (31 × 31 mm) in a surface-mount form factor for board-level integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial thermal environments.
• RoHS Compliant  Manufactured to meet RoHS environmental compliance requirements.

Unique Advantages

• High logic density: 406,720 logic elements provide substantial programmable resources for large-scale designs and parallel processing blocks.
• Significant on-chip RAM: Approximately 29.3 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
• Large I/O array: 500 I/Os enable flexible interfacing to multiple peripherals, sensors, and system buses without immediate external IO expanders.
• Industrial temperature operation: Rated −40 °C to 100 °C to support deployment in demanding thermal environments.
• Compact FCBGA package: 900-ball, 31 × 31 mm footprint balances density and board-area efficiency for surface-mount assembly.
• Controlled core voltage: Narrow core supply range (970 mV–1.03 V) facilitates consistent power-domain design and supply planning.

Why Choose XC7K410T-2FFG900I?

The XC7K410T-2FFG900I combines a large complement of logic elements and embedded memory with a high I/O count in a compact FCBGA package, making it suitable for industrial designs that require substantial programmable resources and reliable operation across a wide temperature range. Its electrical and package specifications support disciplined power-domain and PCB integration choices.

This device is appropriate for teams and projects that need scalable programmable logic capacity with significant on-chip RAM and a large number of I/Os, while maintaining industrial temperature performance and RoHS compliance.

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