XC7K410T-2FFG900C

The XC7K410T-2FFG900C is a Kintex®-7 field programmable gate array (FPGA) from AMD that delivers high logic density and substantial on-chip memory in a compact FCBGA package. With 406,720 logic elements, approximately 29.3 Mbits of embedded memory and 500 user I/O, it is intended for designs that require significant programmable logic resources and flexible I/O capacity.

This commercial-grade, surface-mount device operates over a 0 °C to 85 °C range and uses a core supply from 970 mV to 1.03 V, making it suitable for a wide range of general-purpose electronic applications where high integration and configurable hardware are needed.

Key Features

• Core FPGA Architecture Field Programmable Gate Array providing 406,720 logic elements for implementing complex digital logic and custom hardware functions.
• Embedded Memory Approximately 29.3 Mbits of on-chip RAM to support buffering, state machines, and memory-intensive logic without immediate reliance on external memory.
• I/O Capacity 500 user I/O pins to interface with multiple peripherals, high-speed links, and external devices requiring numerous signal lines.
• Package and Mounting 900-FCBGA (31×31) package case, supplied in a 900-BBGA FCBGA format and intended for surface-mount assembly.
• Power Core voltage supply range specified at 970 mV to 1.03 V to match system power design requirements.
• Operating Conditions Commercial grade device rated for operation from 0 °C to 85 °C and compliant with RoHS environmental requirements.

Typical Applications

• High-density digital processing — Implement large-scale combinational and sequential logic where high logic element counts and on-chip RAM are required.
• Custom hardware acceleration — Offload compute tasks to configurable logic blocks using the device's large logic and memory resources.
• I/O-intensive systems — Connect multiple sensors, peripherals or parallel interfaces using the 500 available I/O pins.

Unique Advantages

• High logic capacity: 406,720 logic elements provide ample programmable resources to consolidate multiple functions into a single device.
• Substantial embedded memory: Approximately 29.3 Mbits of on-chip RAM reduces reliance on external memory for many buffering and state-storage needs.
• Generous I/O count: 500 user I/Os simplify board-level connectivity and reduce the need for additional interface components.
• Compact, industry-standard packaging: 900-FCBGA (31×31) delivers high pin density in a surface-mount form factor suitable for space-constrained PCBs.
• Commercial operating range and RoHS compliance: Clear environmental and grading information supports procurement and assembly planning for general-purpose applications.

Why Choose XC7K410T-2FFG900C?

The XC7K410T-2FFG900C positions itself as a high-density, configurable platform for designers who need large amounts of programmable logic, on-chip memory and extensive I/O in a single, surface-mount FPGA package. Its combination of 406,720 logic elements, approximately 29.3 Mbits of embedded RAM and 500 I/O pins supports consolidation of complex functions while simplifying board-level integration.

As a commercial-grade, RoHS-compliant Kintex®-7 device with a defined core voltage range and package footprint, this part is suitable for teams looking for scalable FPGA resources, predictable electrical requirements and a compact assembly option for general-purpose electronic designs.

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