XC7K410T-3FBG676E

The XC7K410T-3FBG676E is a Kintex®-7 Field Programmable Gate Array offered in a 676-ball FCBGA package. It delivers high logic capacity, abundant on-chip memory and a wide I/O complement in a surface-mount footprint suitable for complex FPGA designs.

Key attributes include approximately 406,720 logic elements, roughly 29.3 Mbits of embedded memory, up to 400 I/O and an extended-grade operating range, making it suited to designs that require high integration and deterministic supply and temperature operating points.

Key Features

• Core & Logic  Approximately 406,720 logic elements organized across 31,775 configurable logic blocks (CLBs) to implement large-scale combinational and sequential logic.
• Embedded Memory  Approximately 29.3 Mbits of on-chip RAM for buffering, lookup tables and local storage to support complex data flows.
• I/O Capacity  Up to 400 I/O pins to handle high pin-count interfacing and multiple parallel connections.
• Power Supply  Core voltage supply range from 970 mV to 1.03 V to match system power-rail requirements and ensure stable device operation.
• Package & Mounting  676-ball FCBGA (676-BBGA, supplier package 676-FCBGA 27×27) in a surface-mount format for compact board-level integration.
• Operating Range & Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C for applications that require extended commercial thermal margins.
• Environmental Compliance  RoHS compliant, aligning with common environmental and lead-free assembly requirements.

Typical Applications

• High-density logic systems  Implement large custom logic functions and signal processing pipelines using the device’s substantial logic element count and CLB resources.
• I/O-intensive interfaces  Support multiple parallel interfaces or wide data buses with up to 400 I/O pins for board-level connectivity.
• On-chip buffering and local storage  Use approximately 29.3 Mbits of embedded memory for frame buffering, FIFOs or local data caching to reduce external memory dependency.
• Compact system integration  Deploy in space-constrained designs using the 676-FCBGA package and surface-mount assembly to keep board footprint minimized.

Unique Advantages

• High logic capacity: Large pool of logic elements enables implementation of complex state machines, pipelined datapaths and dense custom logic.
• Substantial embedded memory: Approximately 29.3 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage tasks.
• Generous I/O count: Up to 400 I/O pins provide flexibility for multi-channel interfaces and parallel data throughput.
• Compact FCBGA package: 676-ball FCBGA (27×27) balances high pin-count capability with a compact board footprint for space-efficient designs.
• Extended-grade operation: Rated for 0 °C to 100 °C operation to meet designs with extended commercial temperature requirements.
• RoHS compliant: Meets lead-free environmental requirements for modern assembly processes.

Why Choose XC7K410T-3FBG676E?

The XC7K410T-3FBG676E provides a high-capacity Kintex®-7 FPGA option for designs that require a large logic fabric, significant embedded memory and a high I/O complement in a compact FCBGA footprint. Its extended-grade rating and defined core voltage range make it suitable for projects that demand predictable operating conditions and consolidation of complex functions onto a single device.

This device is appropriate for engineering teams building logic-dense, I/O-heavy systems where board space and on-chip resources directly influence system architecture and BOM. Its combination of logic, memory and I/O supports scalable integration of multiple functions into one FPGA package.

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