XC7K410T-3FFG900E

The XC7K410T-3FFG900E is a Kintex®-7 FPGA IC by AMD, delivered in a 900-ball FCBGA surface-mount package. It combines high logic capacity and on-chip memory with abundant I/O to support complex, integrated digital designs.

This device is targeted at designs that require high logic density, substantial embedded memory, and a wide I/O count, while operating within an extended-grade temperature range and a defined core voltage window.

Key Features

• Logic Capacity  Provides 406,720 logic elements for implementing large-scale combinational and sequential logic functions.
• Embedded Memory  Approximately 29.3 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Resources  Up to 500 I/O pins to enable broad system interfacing and peripheral connectivity.
• Power and Core Voltage  Core voltage range specified at 0.970 V to 1.03 V for defined power delivery and core operation.
• Package and Mounting  900-FCBGA (31×31) supplier device package / 900-BBGA, FCBGA package case; surface mount mounting type for PCB assembly.
• Operating Range and Grade  Extended-grade operation across 0 °C to 100 °C for deployment in environments matching this temperature window.
• Compliance  RoHS compliant to support regulatory requirements for lead-free assembly.

Typical Applications

• High-density digital logic  Implement complex state machines, custom processors, and large logic functions using 406,720 logic elements.
• On-chip buffering and packet handling  Exploit approximately 29.3 Mbits of embedded RAM for packet buffering, queues, and local data storage.
• Systems with extensive I/O  Use the 500 available I/O pins to aggregate multiple peripherals, interfaces, and sensors on a single device.
• Extended-environment electronics  Deploy in systems that operate within the 0 °C to 100 °C range and require extended-grade components.

Unique Advantages

• High logic density: 406,720 logic elements enable consolidation of large logic functions, reducing the need for multiple discrete FPGAs.
• Substantial on-chip memory: Approximately 29.3 Mbits of embedded RAM minimizes external memory dependencies and accelerates internal data paths.
• Generous I/O count: 500 I/O pins permit extensive peripheral integration and flexible board-level connectivity.
• Defined core voltage range: The 0.970 V to 1.03 V supply window provides clear guidance for power-supply design and voltage regulation.
• FCBGA surface-mount package: The 900-FCBGA (31×31) package supports compact PCB layouts while providing high pin density for complex systems.
• RoHS compliant: Meets lead-free assembly requirements for modern PCB manufacturing processes.

Why Choose XC7K410T-3FFG900E?

The XC7K410T-3FFG900E positions itself as a high-capacity FPGA option for designers needing significant logic resources, on-chip memory, and a large I/O count in a single surface-mount package. Its extended-grade temperature range and defined core voltage make it suitable for systems that operate within those environmental and power envelopes.

Manufactured by AMD and supplied in a 900-FCBGA (31×31) package, this device is appropriate for projects that prioritize integration of complex logic and substantial embedded RAM on a single device while maintaining RoHS compliance and standard surface-mount assembly practices.

Request a quote or submit an inquiry to source XC7K410T-3FFG900E for your next design and receive pricing and availability information tailored to your requirements.