XC7K410T-L2FBG676I
| Part Description |
Kintex®-7 Field Programmable Gate Array (FPGA) IC 400 29306880 406720 676-BBGA, FCBGA |
|---|---|
| Quantity | 631 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 400 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 31775 | Number of Logic Elements/Cells | 406720 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 29306880 |
Overview of XC7K410T-L2FBG676I – Kintex®-7 FPGA, 406,720 logic elements
The XC7K410T-L2FBG676I is a Kintex®-7 field programmable gate array (FPGA) in a 676-ball FCBGA package. It combines high logic capacity and on-chip memory with a 400-pin I/O count, making it suitable for complex, high-density digital designs.
This industrial-grade device operates across a wide temperature range and supports a low-voltage core supply, delivering a compact, manufacturable FPGA solution for demanding embedded and system-level applications.
Key Features
- Logic Capacity Provides 406,720 logic elements and 31,775 logic blocks for implementing large-scale digital designs.
- Embedded Memory Approximately 29 Mbits of on-chip RAM to support buffering, packet processing, and intermediate storage without external memory.
- I/O Resources 400 I/O pins to interface with peripherals, memory, and high-speed system buses.
- Package & Mounting 676-FCBGA (27×27) package in a surface-mount form factor for space-constrained board designs.
- Power Core voltage supply range of 0.97 V to 1.03 V to match power-rail designs and regulator selection.
- Operating Temperature & Grade Industrial-grade device rated for −40 °C to 100 °C for deployment in temperature-challenging environments.
- Compliance RoHS-compliant manufacturing and materials.
Unique Advantages
- High logic density: 406,720 logic elements enable consolidation of multiple functions into a single device, reducing system BOM and board area.
- Substantial on-chip memory: Approximately 29 Mbits of embedded RAM minimizes dependence on external memory for many buffering and data-path tasks.
- Generous I/O count: 400 I/Os support broad connectivity to sensors, transceivers, and daughter boards without immediate need for expansion devices.
- Compact, manufacturable package: 676-FCBGA (27×27) surface-mount package balances pin count with a standard footprint for production assembly.
- Industrial temperature range: Rated from −40 °C to 100 °C for operation in harsher ambient conditions common in industrial deployments.
- Regulated core voltage range: Narrow supply window (0.97–1.03 V) simplifies power-domain planning and regulator selection for stable core operation.
Why Choose XC7K410T-L2FBG676I?
The XC7K410T-L2FBG676I delivers a combination of high logic capacity, significant on-chip memory, and broad I/O in a single industrial-grade FCBGA package. These attributes make it well suited to designs that require dense digital implementation and substantial local memory while maintaining a compact board footprint.
For teams seeking a robust, scalable FPGA building block, this device offers specification-driven value: large logic and memory resources, a predictable core voltage range, and an industrial operating window, all backed by Kintex®-7 architecture product lineage.
Request a quote or submit a pricing and availability inquiry to receive more information and lead-time details for XC7K410T-L2FBG676I.

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