XC7K410T-L2FBG676I

IC FPGA 400 I/O 676FCBGA
Part Description

Kintex®-7 Field Programmable Gate Array (FPGA) IC 400 29306880 406720 676-BBGA, FCBGA

Quantity 631 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O400Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs31775Number of Logic Elements/Cells406720
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits29306880

Overview of XC7K410T-L2FBG676I – Kintex®-7 FPGA, 406,720 logic elements

The XC7K410T-L2FBG676I is a Kintex®-7 field programmable gate array (FPGA) in a 676-ball FCBGA package. It combines high logic capacity and on-chip memory with a 400-pin I/O count, making it suitable for complex, high-density digital designs.

This industrial-grade device operates across a wide temperature range and supports a low-voltage core supply, delivering a compact, manufacturable FPGA solution for demanding embedded and system-level applications.

Key Features

  • Logic Capacity  Provides 406,720 logic elements and 31,775 logic blocks for implementing large-scale digital designs.
  • Embedded Memory  Approximately 29 Mbits of on-chip RAM to support buffering, packet processing, and intermediate storage without external memory.
  • I/O Resources  400 I/O pins to interface with peripherals, memory, and high-speed system buses.
  • Package & Mounting  676-FCBGA (27×27) package in a surface-mount form factor for space-constrained board designs.
  • Power  Core voltage supply range of 0.97 V to 1.03 V to match power-rail designs and regulator selection.
  • Operating Temperature & Grade  Industrial-grade device rated for −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Compliance  RoHS-compliant manufacturing and materials.

Unique Advantages

  • High logic density: 406,720 logic elements enable consolidation of multiple functions into a single device, reducing system BOM and board area.
  • Substantial on-chip memory: Approximately 29 Mbits of embedded RAM minimizes dependence on external memory for many buffering and data-path tasks.
  • Generous I/O count: 400 I/Os support broad connectivity to sensors, transceivers, and daughter boards without immediate need for expansion devices.
  • Compact, manufacturable package: 676-FCBGA (27×27) surface-mount package balances pin count with a standard footprint for production assembly.
  • Industrial temperature range: Rated from −40 °C to 100 °C for operation in harsher ambient conditions common in industrial deployments.
  • Regulated core voltage range: Narrow supply window (0.97–1.03 V) simplifies power-domain planning and regulator selection for stable core operation.

Why Choose XC7K410T-L2FBG676I?

The XC7K410T-L2FBG676I delivers a combination of high logic capacity, significant on-chip memory, and broad I/O in a single industrial-grade FCBGA package. These attributes make it well suited to designs that require dense digital implementation and substantial local memory while maintaining a compact board footprint.

For teams seeking a robust, scalable FPGA building block, this device offers specification-driven value: large logic and memory resources, a predictable core voltage range, and an industrial operating window, all backed by Kintex®-7 architecture product lineage.

Request a quote or submit a pricing and availability inquiry to receive more information and lead-time details for XC7K410T-L2FBG676I.

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