XC7K410T-L2FFG900E

The XC7K410T-L2FFG900E is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD packaged in a 900‑ball FCBGA (31×31) footprint. It delivers high logic capacity, substantial on‑chip memory, and a large I/O complement for demanding programmable-logic designs.

With 406,720 logic elements, approximately 29.3 Mbits of embedded memory and 500 I/O, this device supports designs that require dense logic integration, significant local RAM resources and extensive external connectivity while operating in an extended temperature range.

Key Features

• High Logic Density 406,720 logic elements to implement complex digital functions and parallel processing structures.
• Embedded Memory Approximately 29.3 Mbits of on‑chip RAM to support buffering, lookup tables and local data storage without external memory.
• Large I/O Count 500 user I/O pins to accommodate multi‑channel interfaces and high‑pin‑count system connections.
• Package and Mounting 900‑ball FCBGA package (900‑FCBGA, 31×31) optimized for surface‑mount board assembly and dense PCB layouts.
• Power Supply Range Core supply specified from 970 mV to 1.03 V to match system power rails and regulatory requirements for core voltage.
• Operating Temperature Rated for 0 °C to 100 °C operation consistent with extended‑grade deployment scenarios.
• Environmental Compliance RoHS compliant for reduced hazardous substance content.

Typical Applications

• Custom Digital Processing Implement complex, high‑density logic and custom datapaths using the device’s large logic element count.
• Memory‑Intensive Functions Use the approximately 29.3 Mbits of embedded RAM for buffering, packet queues, and local storage in data‑centric designs.
• Multi‑I/O Systems Support applications requiring many parallel interfaces or channelized I/O with the 500 available I/O pins.

Unique Advantages

• High integration density: 406,720 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Substantial embedded memory: Approximately 29.3 Mbits of on‑chip RAM reduces dependence on external memory and improves data locality.
• Rich I/O capability: 500 I/O pins provide flexibility for interfacing to numerous peripherals and high‑channel systems.
• Compact, surface‑mount FCBGA package: 900‑FCBGA (31×31) supports high‑density PCB layouts and standardized assembly processes.
• Extended grade operation: Specified for 0 °C to 100 °C, enabling deployment in environments that require extended temperature tolerance.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC7K410T-L2FFG900E?

The XC7K410T-L2FFG900E positions itself for designs that demand significant programmable logic capacity, generous on‑chip RAM and broad I/O connectivity in a compact FCBGA package. Its combination of 406,720 logic elements, approximately 29.3 Mbits of embedded memory and 500 I/O make it suitable for consolidating complex digital functions and reducing external component count.

Specified for core voltages from 970 mV to 1.03 V and rated for 0 °C to 100 °C operation, this extended‑grade Kintex®‑7 FPGA provides a balance of integration, configurability and environmental robustness for long‑life, high‑density designs backed by AMD’s Kintex‑7 family documentation and support.

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