XC7K420T-1FFG901C

The XC7K420T-1FFG901C is a Kintex®-7 field programmable gate array (FPGA) from AMD designed for high-density logic and memory integration in a compact FCBGA package. It combines a large logic fabric, substantial embedded RAM, and a high I/O count to address demanding digital designs.

Targeted at applications that require many logic elements, extensive on-chip memory, and numerous external interfaces, this device delivers a balance of integration and board-level density with defined commercial-grade operating limits.

Key Features

• Core Logic 416,960 logic elements to implement complex, high-density logic functions and parallel datapaths.
• Embedded Memory Approximately 30.78 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate data storage within the FPGA fabric.
• Programmable I/O 380 user I/O pins to simplify system integration and enable multiple parallel interfaces and channels.
• Package & Mounting 900-BBGA FCBGA package (supplier device package: 901-FCBGA, 31×31) with surface-mount construction for compact, high-density PCB layouts.
• Power Core voltage supply specified at 970 mV to 1.03 V for predictable power budgeting and board design.
• Temperature & Grade Commercial operating temperature range from 0 °C to 85 °C suitable for standard commercial applications.
• Environmental Compliance RoHS compliant, supporting environmental and hazardous-substance requirements.

Typical Applications

• High-density digital processing — Implement substantial combinational and sequential logic using hundreds of thousands of logic elements for signal processing, control, or compute offload tasks.
• Multi-channel I/O aggregation — Aggregate and route numerous parallel interfaces or channels using the 380 available I/O pins to reduce external glue logic.
• Memory-intensive on-chip functions — Use approximately 30.78 Mbits of embedded RAM for data buffering, packet queues, and lookup storage without external memory.
• Custom hardware acceleration and prototyping — Deploy large custom accelerators or prototype complex ASIC functions within a compact FCBGA package.
• Communications and networking subsystems — Implement interface bridging, packet handling, and logic-heavy protocol processing where integrated logic and I/O density matter.

Unique Advantages

• High logic capacity: 416,960 logic elements enable complex system integration on a single device, reducing external component count.
• Significant on-chip memory: Approximately 30.78 Mbits of embedded RAM minimizes dependence on off-chip memory for buffering and state storage.
• Extensive I/O count: 380 I/O pins allow direct connection to multiple peripherals and parallel interfaces, simplifying board-level routing.
• Compact FCBGA packaging: 900-BBGA / 901-FCBGA (31×31) form factor supports dense PCB designs while maintaining surface-mount assembly.
• Clear power specification: Defined core voltage range (970 mV–1.03 V) assists predictable power-supply and thermal planning.
• RoHS compliance: Helps meet environmental and regulatory requirements for commercial products.

Why Choose XC7K420T-1FFG901C?

The XC7K420T-1FFG901C positions itself for designers who require a high level of integration—large programmable logic capacity, substantial embedded memory, and a high I/O count—in a compact surface-mount FCBGA package. Its defined voltage and commercial temperature range provide predictable integration into standard electronic systems.

Manufactured by AMD, this Kintex®-7 FPGA is suitable for projects that demand on-chip resources to reduce external components and simplify system architecture while meeting RoHS environmental requirements.

Request a quote or submit a sales inquiry to check availability and pricing for the XC7K420T-1FFG901C and to discuss how it fits your design requirements.