XC7K420T-3FFG1156E

The XC7K420T-3FFG1156E is a Kintex®-7 field programmable gate array (FPGA) IC manufactured by AMD, offering high logic capacity and substantial on-chip memory in a compact FCBGA package. Designed for applications that require dense programmable logic, significant embedded RAM, and a broad set of I/O, this device balances integration and performance within a surface-mount 1156-FCBGA footprint.

Key hardware attributes include 416,960 logic elements, approximately 30 Mbits of embedded memory, 400 user I/O pins, an operating temperature range of 0 °C to 100 °C, and a core voltage supply range of 0.97 V to 1.03 V. The device is RoHS compliant and specified in an Extended grade.

Key Features

• Core & Logic  416,960 logic elements provide large programmable capacity for complex digital designs and high-density logic implementations.
• Embedded Memory  Approximately 30 Mbits of on-chip RAM to support buffering, FIFOs, and data-path storage without external memory.
• I/O Count  400 user I/O pins to support wide parallel interfaces, multiple peripherals, and extensive board-level connectivity.
• Package & Mounting  1156-FCBGA (35×35) package in a surface-mount form factor for compact board integration and high pin-count routing.
• Power  Core voltage supply range of 0.97 V to 1.03 V to match system power rails and enable stable core operation within specified limits.
• Temperature & Grade  Extended grade operation from 0 °C to 100 °C for deployments requiring elevated ambient-temperature tolerance.
• Environmental Compliance  RoHS compliant to support regulatory and manufacturing process requirements.

Typical Applications

• Communications Infrastructure  High logic density and abundant I/O make the device suitable for protocol processing, packet handling, and adaptable interface logic.
• Signal Processing  Large embedded memory and extensive logic resources support real-time data buffering, filtering, and pipeline implementations.
• Imaging and Vision  The combination of on-chip RAM and many I/O channels supports image data handling, preprocessing, and camera interface aggregation.
• Test & Measurement  High I/O count and programmable logic capacity enable custom measurement engines, timing control, and data capture solutions.

Unique Advantages

• High Logic Capacity: 416,960 logic elements provide the headroom needed for complex FPGA-based system functions and custom accelerators.
• Substantial On-Chip Memory: Approximately 30 Mbits of embedded RAM reduces reliance on external memory for many buffering and data-path tasks.
• Extensive I/O: 400 user I/O pins allow flexible interfacing to high-pin-count peripherals, parallel busses, and multi-lane systems.
• Compact, High-Pin Package: The 1156-FCBGA (35×35) package delivers a dense pinout in a surface-mount form factor for space-constrained designs.
• Tight Core Voltage Range: 0.97 V to 1.03 V core supply specification supports stable operation with defined power rail planning.
• Extended Temperature Grade: Rated for 0 °C to 100 °C operation to meet systems that operate in elevated ambient environments.

Why Choose XC7K420T-3FFG1156E?

The XC7K420T-3FFG1156E positions itself as a high-capacity Kintex®-7 FPGA option for designs that demand large programmable logic, significant embedded memory, and plentiful I/O in a compact FCBGA footprint. Its specification set makes it well suited for communications, signal processing, imaging, and advanced measurement applications where integration and deterministic hardware behavior are required.

Manufactured by AMD and offered in an Extended grade with RoHS compliance, the device supports projects that need scalable logic resources and reliable on-board memory while fitting into a surface-mount 1156-FCBGA package. Choose this part when your design requires substantial on-chip resources and a high I/O count within a defined operating and power envelope.

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