XC7K420T-3FFG901E

The XC7K420T-3FFG901E is a Kintex®-7 FPGA from AMD, provided in a 900-ball FCBGA package. It is a high-density, reprogrammable logic device designed for complex digital integration where large logic capacity, substantial on-chip memory, and a high I/O count are required.

With 416,960 logic elements, approximately 30.78 Mbits of embedded memory, and 380 user I/Os, this extended-grade FPGA targets applications that need significant logic and memory resources while operating within a 0 °C to 100 °C temperature window and a core supply range of 0.97 V to 1.03 V.

Key Features

• Logic Capacity  Provides 416,960 logic elements to implement large-scale combinational and sequential logic designs.
• Embedded Memory  Approximately 30.78 Mbits of on-chip RAM suitable for buffering, local storage, and implementation of memory-intensive functions.
• I/O Resources  380 user I/Os for broad interface flexibility and connectivity to external devices and subsystems.
• Power and Core Voltage  Operates with a supply range from 0.97 V to 1.03 V, enabling low-voltage core operation consistent with modern FPGA power domains.
• Package and Mounting  Surface-mount 900-BBGA (FCBGA) package; supplier device package listed as 901-FCBGA (31 × 31) for compact, high-pin-count system designs.
• Temperature and Grade  Extended-grade device rated for operation from 0 °C to 100 °C.
• Environmental Compliance  RoHS compliant, supporting lead-free assembly and regulatory requirements.

Typical Applications

• Prototyping and System Development  Leverages 416,960 logic elements and substantial on-chip memory to implement and validate large digital systems and custom IP cores.
• Data Aggregation and I/O Bridging  380 I/Os enable consolidation of multiple peripheral interfaces and aggregation of signals in complex embedded systems.
• Hardware Acceleration  Significant logic and RAM resources support offloading compute-intensive or parallel tasks to an FPGA fabric for improved system-level throughput.

Unique Advantages

• High Logic Density: 416,960 logic elements allow implementation of large and complex digital functions without external logic expansion.
• Substantial On-Chip Memory: Approximately 30.78 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Ample I/O: 380 user I/Os simplify integration with multiple peripherals and enable versatile connectivity options.
• Compact High-Pin-Count Package: 900-BBGA (901-FCBGA, 31 × 31) balances pin density with a compact footprint for space-constrained boards.
• Controlled Core Voltage: Operating range of 0.97 V to 1.03 V supports designs targeting low-voltage core domains.
• Extended Temperature Grade: Rated 0 °C to 100 °C for applications requiring operation across typical commercial-to-wider temperature ranges.

Why Choose XC7K420T-3FFG901E?

The XC7K420T-3FFG901E combines high logic density, sizable embedded memory, and a broad I/O complement in a single extended-grade FPGA package. These characteristics make it suitable for engineering teams and procurement groups seeking a single-device solution for complex digital integration, I/O consolidation, and hardware acceleration tasks.

Backed by AMD's Kintex®-7 lineage, this device offers a balance of integration and predictable electrical and thermal requirements—providing design scalability, reduced external component count, and adherence to RoHS environmental requirements for long-term deployment.

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