XC7K420T-2FFG901I

The XC7K420T-2FFG901I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 900‑ball FCBGA package. It provides high logic density and significant on‑chip memory in a surface‑mount form factor targeted for industrial applications.

With 416,960 logic elements, approximately 30.78 Mbits of embedded memory, and 380 I/Os, this device is intended for designs that require dense programmable logic, substantial embedded RAM, and a broad I/O set while operating across an industrial temperature range.

Key Features

• Logic Capacity  416,960 logic elements to support complex, high‑density digital designs.
• Embedded Memory  Approximately 30.78 Mbits of on‑chip RAM for buffering, state storage, and local data processing.
• I/O Count  380 general-purpose I/Os to accommodate large peripheral sets and high pin‑count interfaces.
• Power  Core voltage supply specified at 970 mV to 1.03 V for the device core domain.
• Package & Mounting  900‑BBGA FCBGA package (supplier device package: 901‑FCBGA, 31×31) designed for surface‑mount assembly.
• Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial temperature environments.
• Compliance  RoHS compliant, supporting environmental regulatory requirements for lead‑free assemblies.

Typical Applications

• High‑density digital designs  Implement complex logic pipelines and custom processing engines using the device’s large logic element count.
• Embedded memory‑intensive functions  Use the approximately 30.78 Mbits of on‑chip RAM for buffering, data queues, and local storage needs.
• IO‑rich systems  Integrate multiple external interfaces and peripherals leveraging 380 available I/O pins.
• Industrial control and automation  Deploy in systems that require industrial temperature operation and robust, surface‑mount packaging.

Unique Advantages

• High logic density: 416,960 logic elements enable consolidation of multiple functions into a single device, reducing BOM count.
• Significant embedded RAM: Approximately 30.78 Mbits of on‑chip memory supports local data processing and reduces dependence on external memory.
• Extensive I/O resources: 380 I/Os provide flexibility to connect numerous sensors, peripherals, and high‑pin‑count interfaces without multiplexing compromises.
• Industrial temperature rating: Operation from −40 °C to 100 °C aligns the device with industrial application requirements for extended temperature ranges.
• Compact, assembly‑friendly package: 901‑FCBGA (31×31) in a 900‑BBGA footprint supports surface‑mount manufacturing and dense board layouts.
• RoHS compliant: Meets lead‑free environmental requirements for modern electronics production.

Why Choose XC7K420T-2FFG901I?

The XC7K420T-2FFG901I combines a large logic fabric, substantial embedded memory, and a high I/O count in a compact FCBGA package, providing a balanced solution for dense, memory‑aware FPGA implementations. Its specified core voltage range and industrial temperature rating make it suitable for designs that demand stable operation across varied conditions.

This part is appropriate for engineers and procurement teams seeking a programmable device that consolidates complex logic, supports significant on‑chip data storage, and offers extensive connectivity while conforming to RoHS requirements. The package and mounting choices also support surface‑mount production and compact system integration.

Request a quote or submit an inquiry to get pricing, availability, and lead‑time information for the XC7K420T-2FFG901I.