XC7K480T-1FFG1156C

The XC7K480T-1FFG1156C is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD, offered in a 1156-ball FCBGA package. It provides large programmable logic capacity and substantial on-chip RAM in a surface-mount package, suited for designs that require high logic density, abundant I/O, and commercial-temperature operation.

Key Features

• Logic Capacity — 477,760 logic elements and 37,325 configurable logic blocks (CLBs) to support large-scale programmable designs.
• Embedded Memory — Approximately 35.2 Mbits of on-chip RAM for buffering, lookup tables, and memory-intensive algorithms.
• I/O Density — 400 user I/O pins to accommodate complex interfacing and multiple peripheral connections.
• Power — Core voltage supply range specified at 970 mV to 1.03 V, enabling defined power design and sequencing.
• Package and Mounting — 1156-FCBGA (35x35) supplier device package in a surface-mount form factor for compact board integration.
• Operating Grade and Temperature — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS compliant for materials and manufacturing conformance.

Typical Applications

• High-density logic designs — Deploy large programmable logic capacity where complex custom logic and many concurrent functions are required.
• Memory‑intensive processing — Use the approximately 35.2 Mbits of embedded RAM for on-chip buffering, LUTs, and temporary storage.
• I/O‑rich systems — Leverage 400 user I/Os to integrate numerous peripherals, interfaces, or signal channels directly on the FPGA.
• Compact surface-mount implementations — The 1156-FCBGA package supports high-density board layouts while maintaining robust package integration.

Unique Advantages

• Substantial logic resources: 477,760 logic elements and 37,325 CLBs enable consolidation of large digital functions into a single device, reducing BOM count.
• Significant on-chip RAM: Approximately 35.2 Mbits of embedded memory lowers the need for external memory in many designs.
• High I/O count: 400 user I/Os allow broad connectivity for multi-channel, multi-protocol, or multi-peripheral systems.
• Defined power window: Core supply specified at 970 mV–1.03 V supports predictable power sequencing and design planning.
• Commercial-temperature qualification: Rated for 0 °C to 85 °C operation to match standard commercial application environments.
• RoHS compliant: Materials and manufacturing meet RoHS requirements for environmental and regulatory considerations.

Why Choose XC7K480T-1FFG1156C?

The XC7K480T-1FFG1156C positions itself as a high-density Kintex‑7 FPGA option that combines large logic element counts, ample embedded RAM, and extensive I/O in a single 1156‑ball FCBGA surface-mount package. Its electrical and thermal specifications—along with RoHS compliance—make it suitable for commercial designs that require significant integration and deterministic design parameters.

Manufactured by AMD, this device is appropriate for engineering teams seeking to consolidate complex programmable logic and memory needs into one FPGA while maintaining clear power and temperature boundaries for reliable system integration.

Request a quote or submit a pricing inquiry today to evaluate the XC7K480T-1FFG1156C for your next design project.