XC7K480T-1FFG901I
| Part Description |
Kintex-7 FPGA, XC7K480T, 477,760 Logic Cells, 1920 DSP, FFG901, Commercial |
|---|---|
| Quantity | 1,980 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | FFG901 | Grade | N/A | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 901-BGA | Number of I/O | 400 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 | Number of LABs/CLBs | 298600 | Number of Logic Elements/Cells | 477760 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.31.00.60 | ||
| Qualification | N/A | Total RAM Bits | 35205120 |
Overview of XC7K480T-1FFG901I – Kintex®-7 FPGA, 900-BBGA (FCBGA)
The XC7K480T-1FFG901I is a Kintex®-7 field programmable gate array (FPGA) device optimized for applications that require significant programmable logic, embedded memory, and flexible I/O. It delivers 477,760 logic elements, approximately 35.2 Mbits of embedded memory, and 380 I/O pins in a high-density FCBGA package.
Designed for surface-mount assembly and rated to industrial temperature ranges, the device supports a core supply range of 970 mV to 1.03 V and is RoHS compliant—making it suitable for industrial applications where programmable, high-density logic and robust thermal performance are required.
Key Features
- Core Logic 477,760 logic elements provide extensive programmable logic capacity for complex digital designs and system integration.
- Embedded Memory Approximately 35.2 Mbits of on-chip RAM to implement large buffering, lookup tables, and state storage without external memory.
- I/O Resources 380 general-purpose I/O pins enable broad interfacing options for sensors, peripherals, and high-density board designs.
- Power Core supply voltage specified from 970 mV to 1.03 V, supporting defined power delivery for the FPGA core.
- Package & Mounting 900-BBGA, FCBGA package with supplier device package 901-FCBGA (31×31) in a surface-mount form factor for compact, high-density PCB layouts.
- Thermal & Grade Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for elevated-temperature environments.
- Compliance RoHS compliant.
Typical Applications
- Industrial Control Use the device's large logic capacity and 380 I/Os for motor control, PLC logic expansion, and deterministic I/O handling in industrial systems.
- Data Processing & Buffering Approximately 35.2 Mbits of on-chip RAM support high-throughput buffering and intermediate data storage for real-time processing tasks.
- High-Density I/O Systems The 900-BBGA FCBGA package and 380 I/Os enable compact boards with extensive peripheral connectivity for embedded instrumentation and test equipment.
Unique Advantages
- Large Programmable Capacity: 477,760 logic elements enable complex logic implementation and high levels of integration on a single device, reducing external components.
- Significant On-Chip Memory: Approximately 35.2 Mbits of embedded RAM lowers dependence on external memory for buffering and state retention, simplifying board design.
- High I/O Count: 380 I/Os provide flexibility to connect multiple peripherals and interfaces without additional multiplexing hardware.
- Industrial Temperature Rating: Rated from −40 °C to 100 °C for deployment in temperature-challenging industrial environments.
- Compact, High-Density Package: 900-BBGA (901-FCBGA, 31×31) surface-mount package supports compact PCB layouts while delivering high pin density.
- RoHS Compliant: Meets RoHS requirements for environmental and regulatory preference.
Why Choose XC7K480T-1FFG901I?
The XC7K480T-1FFG901I combines substantial programmable logic, abundant on-chip memory, and a high I/O count in a compact FCBGA package, offering a balance of performance and integration for industrial-grade designs. Its defined core voltage range and industrial operating temperatures support reliable deployment in demanding environments.
This device is well suited to engineering teams building complex, high-density digital systems that require scalable logic resources, significant embedded RAM, and robust I/O capabilities—providing long-term value through integration and a footprint optimized for surface-mount, high-pin-count applications.
Request a quote or submit your requirements to receive pricing and availability information for the XC7K480T-1FFG901I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








