XC7K480T-2FFG901I

The XC7K480T-2FFG901I is an industrial-grade Kintex®-7 Field Programmable Gate Array (FPGA) from AMD. This device provides a high-density programmable fabric with 477,760 logic elements and approximately 35 Mbits of embedded memory, designed for applications requiring extensive on-chip logic and storage.

With 380 dedicated I/O pins, a narrow core voltage range, and a compact FCBGA package, the part targets industrial systems and high-density FPGA-based designs that require robust operating temperature support and surface-mount packaging.

Key Features

• Logic Capacity — 477,760 logic elements available for implementing complex digital designs and large-scale programmable logic.
• Embedded Memory — Approximately 35 Mbits of on-chip RAM bits for data buffering, state storage, and user memory needs.
• I/O — 380 I/O pins to support extensive interfacing and parallel connectivity requirements.
• Power Supply — Core voltage supply range of 0.97 V to 1.03 V to match system power rails and design constraints.
• Package — 900-BBGA, FCBGA package; supplier device package listed as 901-FCBGA (31 × 31) for compact, high-density board implementations.
• Mounting — Surface mount package suitable for modern PCB assembly processes.
• Operating Temperature — Rated for −40 °C to 100 °C to meet industrial temperature requirements.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Industrial-grade temperature rating and high logic capacity make the device suitable for complex control and automation systems.
• High-Density FPGA-Based Systems — Large logic element count and substantial on-chip memory support densely integrated programmable logic implementations.
• Interfaces and I/O-Intensive Designs — 380 I/Os enable broad peripheral connectivity and parallel data paths on compact boards.

Unique Advantages

• High Logic and Memory Density: 477,760 logic elements and approximately 35 Mbits of embedded memory provide extensive on-chip resources for complex designs.
• Broad I/O Support: 380 I/O pins accommodate multiple interfaces and parallel data channels without external expander chips.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in demanding environments.
• Compact, High-Density Package: 900-BBGA / 901-FCBGA (31 × 31) packaging enables space-efficient board layouts while maintaining high pin count.
• Tight Core Voltage Window: 0.97 V to 1.03 V supply range provides defined power requirements for stable operation.
• RoHS Compliant: Meets common environmental compliance requirements for electronic assemblies.

Why Choose XC7K480T-2FFG901I?

The XC7K480T-2FFG901I delivers a combination of high logic density, significant embedded memory, and extensive I/O in a compact FCBGA package suited to industrial-grade deployments. It is positioned for designs that require substantial on-chip resources, reliable operation across wide temperatures, and a high pin-count interface in a surface-mount form factor.

Engineers and procurement teams designing industrial systems or high-density FPGA-based boards will find the device offers the core capabilities and environmental specifications needed for robust, scalable implementations while meeting RoHS requirements.

If you would like pricing or availability information, request a quote or submit your requirements and a sales specialist will respond with a formal quote and lead-time details.