XC7K480T-L2FFG901I

IC FPGA 380 I/O 901FCBGA
Part Description

Kintex®-7 Field Programmable Gate Array (FPGA) IC 380 35205120 477760 900-BBGA, FCBGA

Quantity 1,133 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package901-FCBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case900-BBGA, FCBGANumber of I/O380Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs37325Number of Logic Elements/Cells477760
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits35205120

Overview of XC7K480T-L2FFG901I – Kintex®-7 FPGA, 900‑BBGA (Industrial)

The XC7K480T-L2FFG901I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC offering high logic density and extensive on-chip memory in a 900‑ball FCBGA package. It provides a large array of programmable logic, abundant embedded RAM, and a broad set of I/O to support demanding industrial designs.

With industrial temperature grading and RoHS compliance, this device is suited to applications that require sustained operation across a wide temperature range while leveraging the Kintex‑7 architecture’s capacity for complex logic and I/O integration.

Key Features

  • Logic Capacity  Approximately 477,760 logic elements to implement large, parallel digital designs and state machines.
  • Programmable Logic Blocks  37,325 CLB-like structures reported as part of the device logic resource set to organize combinational and sequential logic.
  • Embedded Memory  Approximately 35.2 Mbits of on‑chip RAM for buffers, FIFOs, and local storage of intermediate data.
  • I/O Resources  380 dedicated I/O pins to interface with external devices, peripherals, and boards.
  • Package  900‑BBGA FCBGA in a supplier device package of 901‑FCBGA (31×31) for high‑density board integration and reliable surface mounting.
  • Supply Voltage Range  Voltage supply range listed as 970 mV to 1.03 V, matching tight core supply requirements.
  • Thermal and Environmental  Industrial operating temperature range from −40°C to 100°C and RoHS compliant for environmental compatibility.
  • Mounting  Surface mount package suitable for automated PCB assembly processes.

Typical Applications

  • Industrial Automation  Use the device’s 477,760 logic elements and 380 I/Os to implement complex control, I/O aggregation, and deterministic processing in industrial equipment.
  • Communications Infrastructure  Leverage the large logic and on‑chip memory capacity to handle packet processing, protocol bridging, and interface consolidation in network equipment.
  • Test & Measurement  Deploy the device where high‑density logic and local RAM are needed for real‑time signal processing, data buffering, and custom measurement engines.
  • Imaging and Video Processing  Apply the abundant logic and memory resources for data path acceleration, frame buffering, and parallel compute tasks in imaging systems.

Unique Advantages

  • High Logic Density: The large count of logic elements enables implementation of complex, highly parallel designs on a single device, reducing system-level component count.
  • Substantial On‑Chip Memory: Approximately 35.2 Mbits of embedded RAM supports large buffers and local data storage, minimizing external memory dependencies.
  • Extensive I/O Count: 380 I/Os provide flexible interfacing options for multi‑lane or multi‑peripheral systems without extensive external multiplexing.
  • Industrial Temperature Range: Rated for −40°C to 100°C operation, addressing thermal requirements for industrial deployments.
  • Compact FCBGA Package: 900‑BBGA / 901‑FCBGA (31×31) offers a high‑density footprint for space‑constrained boards while supporting surface mount assembly.
  • Regulatory Compatibility: RoHS compliance supports use in environmentally regulated product lines.

Why Choose XC7K480T-L2FFG901I?

The XC7K480T-L2FFG901I positions itself as a high‑capacity Kintex‑7 FPGA option for designers who need substantial programmable logic, extensive embedded memory, and a large complement of I/O in an industrial‑grade device. Its combination of nearly half a million logic elements, approximately 35.2 Mbits of on‑chip RAM, and 380 I/Os enables consolidation of complex functions onto a single FPGA, reducing board-level complexity.

This device suits engineering teams building industrial, communications, test, or imaging systems that require sustained operation over a wide temperature range and a RoHS‑compliant component. The 900‑ball FCBGA package supports dense PCB layouts while providing the platform capacity to scale design functionality within the Kintex‑7 family resource envelope.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for XC7K480T-L2FFG901I. Our team can provide detailed procurement information and assist with configuration requirements.

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