XC7K480T-L2FFG901I
| Part Description |
Kintex®-7 Field Programmable Gate Array (FPGA) IC 380 35205120 477760 900-BBGA, FCBGA |
|---|---|
| Quantity | 1,133 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 901-FCBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 900-BBGA, FCBGA | Number of I/O | 380 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 37325 | Number of Logic Elements/Cells | 477760 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 35205120 |
Overview of XC7K480T-L2FFG901I – Kintex®-7 FPGA, 900‑BBGA (Industrial)
The XC7K480T-L2FFG901I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC offering high logic density and extensive on-chip memory in a 900‑ball FCBGA package. It provides a large array of programmable logic, abundant embedded RAM, and a broad set of I/O to support demanding industrial designs.
With industrial temperature grading and RoHS compliance, this device is suited to applications that require sustained operation across a wide temperature range while leveraging the Kintex‑7 architecture’s capacity for complex logic and I/O integration.
Key Features
- Logic Capacity Approximately 477,760 logic elements to implement large, parallel digital designs and state machines.
- Programmable Logic Blocks 37,325 CLB-like structures reported as part of the device logic resource set to organize combinational and sequential logic.
- Embedded Memory Approximately 35.2 Mbits of on‑chip RAM for buffers, FIFOs, and local storage of intermediate data.
- I/O Resources 380 dedicated I/O pins to interface with external devices, peripherals, and boards.
- Package 900‑BBGA FCBGA in a supplier device package of 901‑FCBGA (31×31) for high‑density board integration and reliable surface mounting.
- Supply Voltage Range Voltage supply range listed as 970 mV to 1.03 V, matching tight core supply requirements.
- Thermal and Environmental Industrial operating temperature range from −40°C to 100°C and RoHS compliant for environmental compatibility.
- Mounting Surface mount package suitable for automated PCB assembly processes.
Typical Applications
- Industrial Automation Use the device’s 477,760 logic elements and 380 I/Os to implement complex control, I/O aggregation, and deterministic processing in industrial equipment.
- Communications Infrastructure Leverage the large logic and on‑chip memory capacity to handle packet processing, protocol bridging, and interface consolidation in network equipment.
- Test & Measurement Deploy the device where high‑density logic and local RAM are needed for real‑time signal processing, data buffering, and custom measurement engines.
- Imaging and Video Processing Apply the abundant logic and memory resources for data path acceleration, frame buffering, and parallel compute tasks in imaging systems.
Unique Advantages
- High Logic Density: The large count of logic elements enables implementation of complex, highly parallel designs on a single device, reducing system-level component count.
- Substantial On‑Chip Memory: Approximately 35.2 Mbits of embedded RAM supports large buffers and local data storage, minimizing external memory dependencies.
- Extensive I/O Count: 380 I/Os provide flexible interfacing options for multi‑lane or multi‑peripheral systems without extensive external multiplexing.
- Industrial Temperature Range: Rated for −40°C to 100°C operation, addressing thermal requirements for industrial deployments.
- Compact FCBGA Package: 900‑BBGA / 901‑FCBGA (31×31) offers a high‑density footprint for space‑constrained boards while supporting surface mount assembly.
- Regulatory Compatibility: RoHS compliance supports use in environmentally regulated product lines.
Why Choose XC7K480T-L2FFG901I?
The XC7K480T-L2FFG901I positions itself as a high‑capacity Kintex‑7 FPGA option for designers who need substantial programmable logic, extensive embedded memory, and a large complement of I/O in an industrial‑grade device. Its combination of nearly half a million logic elements, approximately 35.2 Mbits of on‑chip RAM, and 380 I/Os enables consolidation of complex functions onto a single FPGA, reducing board-level complexity.
This device suits engineering teams building industrial, communications, test, or imaging systems that require sustained operation over a wide temperature range and a RoHS‑compliant component. The 900‑ball FCBGA package supports dense PCB layouts while providing the platform capacity to scale design functionality within the Kintex‑7 family resource envelope.
Request a quote or submit an inquiry to obtain pricing, lead time, and availability for XC7K480T-L2FFG901I. Our team can provide detailed procurement information and assist with configuration requirements.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








