XC7K70T-1FB676I

The XC7K70T-1FB676I is an AMD Kintex®-7 field programmable gate array supplied in a 676-ball FCBGA package. It combines a high logic capacity with substantial on-chip memory and a broad I/O count for industrial embedded designs.

Designed for industrial-grade applications, this device provides approximately 4.98 Mbits of embedded memory, 65,600 logic elements, and 300 user I/Os while supporting a core supply range of 970 mV to 1.03 V and an operating temperature range from -40 °C to 100 °C.

Key Features

• Logic Capacity  65,600 logic elements suitable for complex custom logic and control implementations.
• Embedded Memory  Approximately 4.98 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Count  300 user I/Os to interface with external peripherals, sensors, and high-pin-count systems.
• Package  676-BBGA (676-FCBGA) package, supplier package specified as 676-FCBGA (27×27) for surface-mount board integration.
• Power  Core supply operating range from 970 mV to 1.03 V to match system power-rail design requirements.
• Operating Conditions  Industrial temperature rating from -40 °C to 100 °C for robust performance across a wide thermal range.
• Mounting  Surface mount device suitable for modern PCB assembly flows.
• Environmental  RoHS compliant.

Typical Applications

• Industrial Control  Custom logic, motor control interfaces, and I/O aggregation where industrial temperature range and high logic capacity are required.
• Embedded Processing  Hardware-accelerated signal processing and system glue logic benefiting from on-chip memory and sizeable logic resources.
• Communications Equipment  I/O-dense front-end processing and protocol handling leveraging 300 user I/Os and flexible logic allocation.
• Test & Measurement  Real-time data acquisition and preprocessing using embedded RAM and configurable logic blocks.

Unique Advantages

• High logic density: 65,600 logic elements enable implementation of complex custom functions without external ASICs.
• Substantial on-chip memory: Approximately 4.98 Mbits of embedded RAM reduces dependency on external memory for many buffering and state tasks.
• Generous I/O capability: 300 user I/Os provide flexibility for multi-interface designs and high-pin-count peripheral connectivity.
• Industrial temperature rating: Specified -40 °C to 100 °C operation supports deployment in demanding environments.
• Compact FCBGA package: 676-ball FCBGA (27×27 mm) package balances high density with manufacturability for surface-mount assembly.
• Regulatory readiness: RoHS compliance simplifies environmental regulatory considerations.

Why Choose XC7K70T-1FB676I?

The XC7K70T-1FB676I positions itself as an industrial-grade Kintex®-7 FPGA option for engineers needing a balance of logic capacity, embedded memory, and extensive I/O in a compact FCBGA package. Its specified operating voltage range and temperature rating make it suitable for systems that must operate reliably across a wide set of conditions.

This device is appropriate for development teams building medium-to-high complexity embedded systems, communications interfaces, and industrial control equipment where on-chip resources and I/O density can reduce board-level complexity and component count.

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