XC7K70T-1FBG484I

IC FPGA 285 I/O 484FCBGA
Part Description

Kintex®-7 Field Programmable Gate Array (FPGA) IC 285 4976640 65600 484-BBGA, FCBGA

Quantity 81 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGA, FCBGANumber of I/O285Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5125Number of Logic Elements/Cells65600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4976640

Overview of XC7K70T-1FBG484I – Kintex®-7 FPGA, 484‑FCBGA

The XC7K70T-1FBG484I is a Kintex®‑7 Field Programmable Gate Array (FPGA) from AMD supplied in a 484‑ball FCBGA package. It provides a balance of programmable logic capacity, embedded RAM, and I/O resources in an industrial‑grade device rated for surface‑mount assembly.

Key device attributes include 65,600 logic elements, approximately 4.98 Mbits of embedded memory, 285 user I/Os, a nominal core supply range of 0.970 V–1.03 V, and an operating temperature range of −40 °C to 100 °C.

Key Features

  • Core and Logic  Provides 65,600 logic elements for implementing custom digital logic and programmable functions.
  • Embedded Memory  Approximately 4.98 Mbits of on‑chip RAM (total RAM bits: 4,976,640) to support buffers, FIFOs, and local data storage.
  • I/O Resources  285 user I/Os to accommodate wide external interfacing and parallel connectivity requirements.
  • Power  Specified core voltage supply range of 0.970 V to 1.03 V for core power planning and supply design.
  • Package and Mounting  484‑BBGA (484‑FCBGA, supplier package 23 × 23 mm) in a surface‑mount form factor for compact board integration.
  • Temperature and Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for temperature‑sensitive deployments.
  • Compliance  RoHS compliant.
  • Manufacturer  AMD Kintex‑7 family device.

Unique Advantages

  • Substantial programmable logic capacity: 65,600 logic elements enable implementation of complex custom logic in a single device.
  • On‑chip memory for local buffering: Approximately 4.98 Mbits of embedded RAM reduces dependence on external memory for many control and buffering tasks.
  • Generous I/O count: 285 user I/Os support broad external interfacing without immediate need for additional I/O expanders.
  • Industrial operating range: −40 °C to 100 °C rating supports deployment in temperature‑challenging environments.
  • Compact FCBGA package: 484‑ball FCBGA (23 × 23 mm) offers a space‑efficient assembly for dense board designs.
  • Standards compliance: RoHS compliance simplifies regulatory considerations for environmental materials requirements.

Why Choose XC7K70T-1FBG484I?

The XC7K70T-1FBG484I delivers a blend of logic capacity, embedded memory, and I/O density in an industrial‑grade Kintex‑7 FPGA footprint. Its specification set—including 65,600 logic elements, approximately 4.98 Mbits of on‑chip RAM, 285 I/Os, and a −40 °C to 100 °C operating range—makes it well suited for designs that require substantial programmable resources in a compact surface‑mount package.

This device appeals to teams looking for a robust, vendor‑backed Kintex‑7 option with clearly defined electrical and thermal parameters for board‑level integration and system planning.

Request a quote or submit an inquiry for XC7K70T-1FBG484I with your required quantity and delivery timeframe to receive pricing and availability information.

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